Parametric results for: Other Memory ICs

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Sorted By: Memory Width
Select parts from the table below to compare.
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MM5280J055
National Semiconductor Corporation
Check for Price No Obsolete 4.096 kbit 1 4KX1 270 ns 64 SEPARATE 4000 4.096 k 3-STATE MOS COMMERCIAL R-XDIP-T22 Not Qualified e0 55 °C 22 CERAMIC DIP DIP22,.4 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL NATIONAL SEMICONDUCTOR CORP compliant EAR99 8542.32.00.71
DS2423P/T&R
Dallas Semiconductor
Check for Price Transferred 4.096 kbit 1 4KX1 5 V MEMORY CIRCUIT 1 4000 4.096 k SYNCHRONOUS OPEN-DRAIN 5.5 V 2.8 V MOS INDUSTRIAL R-PDSO-C6 Not Qualified 85 °C -40 °C 6 PLASTIC/EPOXY RECTANGULAR SMALL OUTLINE YES C BEND DUAL DALLAS SEMICONDUCTOR unknown EAR99 8542.32.00.71 TSOC-6
S29DS032J100FFE000
Spansion
Check for Price Obsolete 33.5544 Mbit 1 32MX1 1.8 V MEMORY CIRCUIT 1 32000000 33.5544 M SYNCHRONOUS 1.95 V 1.65 V CMOS AUTOMOTIVE R-PBGA-B80 125 °C -40 °C 80 PLASTIC/EPOXY BGA RECTANGULAR GRID ARRAY YES BALL BOTTOM SPANSION INC unknown EAR99 8542.32.00.71 BGA, BGA 80
H8F2SBRQCMJR-4HM
SK Hynix Inc
Check for Price Active 8.5899 Gbit 1 8GX1 3.3 V MEMORY CIRCUIT SEATED HT-CALCULATED AND NAND FLASH IS O... more 1 8000000000 8.5899 G SYNCHRONOUS 3.6 V 2.7 V CMOS OTHER R-PBGA-B199 85 °C -30 °C 199 PLASTIC/EPOXY LFBGA RECTANGULAR GRID ARRAY, LOW PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1.4 mm 18 mm 12 mm SK HYNIX INC compliant EAR99 8542.32.00.71 FBGA-199
DS1963L-F5
Dallas Semiconductor
Check for Price Transferred 4.096 kbit 1 4KX1 MEMORY CIRCUIT 1 4000 4.096 k ASYNCHRONOUS 6 V 2.8 V CMOS OTHER O-MEDB-N2 Not Qualified 70 °C -40 °C 2 METAL BUTTON,.68IN ROUND DISK BUTTON YES NO LEAD END DALLAS SEMICONDUCTOR unknown EAR99 8542.32.00.71 MICROCAN-2
AT88SC0104C-MP
Atmel Corporation
Check for Price No No Transferred 1.024 kbit 1 1KX1 CRYPTO MEMORY 1 1000 1.024 k SYNCHRONOUS 5.5 V 2.7 V CMOS R-XUUC-N8 Not Qualified 1 70 °C 8 UNSPECIFIED DIE DIE OR CHIP RECTANGULAR UNCASED CHIP YES NO LEAD UPPER ATMEL CORP compliant EAR99 8542.32.00.71 , CARD 8
MM5262D
Texas Instruments
Check for Price No Obsolete 2.048 kbit 1 2KX1 32 SEPARATE 2000 2.048 k MOS COMMERCIAL R-XDIP-T22 Not Qualified e0 70 °C 22 CERAMIC DIP DIP22,.4 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL NATIONAL SEMICONDUCTOR CORP unknown EAR99 8542.32.00.71 DIP, DIP22,.4
DS2405P
Maxim Integrated Products
Check for Price No Obsolete 64 bit 1 64X1 MEMORY CIRCUIT 1 64 64 words ASYNCHRONOUS 6 V 2.8 V CMOS INDUSTRIAL R-PDSO-C6 Not Qualified e0 1 85 °C -40 °C 6 PLASTIC/EPOXY SOC SOC6,.17 RECTANGULAR SMALL OUTLINE YES TIN LEAD C BEND 1.27 mm DUAL 1.5 mm 3.94 mm 3.76 mm MAXIM INTEGRATED PRODUCTS INC not_compliant EAR99 8542.39.00.01 3.70 X 4 MM, 1.50 MM HEIGHT, TSOC-6 SOIC 6
XC17S10XLPD8C
AMD Xilinx
Check for Price No Obsolete 95.752 kbit 1 95752X1 3.3 V 10 MHz MEMORY CIRCUIT COMMON 1 95752 95.752 k SYNCHRONOUS 3-STATE 50 µA 5 µA 3.6 V 3 V CMOS COMMERCIAL R-PDIP-T8 Not Qualified e0 1 70 °C 225 30 8 PLASTIC/EPOXY DIP DIP8,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 4.5974 mm 9.3599 mm 7.62 mm XILINX INC not_compliant EAR99 8542.32.00.71 PLASTIC, DIP-8 DIP 8
AT88SC25616C-MPTG
Microchip Technology Inc
Check for Price Active 262.144 kbit 1 256KX1 MEMORY CIRCUIT 1 256000 262.144 k SYNCHRONOUS 5.5 V 2.7 V CMOS COMMERCIAL R-XXMA-X8 70 °C 8 UNSPECIFIED RECTANGULAR MICROELECTRONIC ASSEMBLY NO UNSPECIFIED UNSPECIFIED MICROCHIP TECHNOLOGY INC compliant EAR99 8542.32.00.71 CARD MODULE-8