Parametric results for: OTP ROMs

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AT27C010L-55TCT/R
Atmel Corporation
Check for Price Obsolete 256 bit 8 32X8 5 V 35 ns OTP ROM 1 32 131.072 k ASYNCHRONOUS 3-STATE PARALLEL 25 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G32 Not Qualified 70 °C 32 PLASTIC/EPOXY TSOP1 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES GULL WING 500 µm DUAL 1.2 mm 18.4 mm 8 mm ATMEL CORP TSOP TSOP1, 32 unknown EAR99 8542.32.00.71
JBP38S030-30MJ
Texas Instruments
Check for Price No Obsolete 8 32X8 5 V 30 ns OTP ROM 32 32 words 125 µA TTL MILITARY R-XDIP-T16 Not Qualified 125 °C -55 °C NOT SPECIFIED 38535Q/M;38534H;883B NOT SPECIFIED 16 CERAMIC DIP DIP16,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL TEXAS INSTRUMENTS INC DIP, DIP16,.3 not_compliant EAR99 8542.32.00.71
53S881N
AMD
Check for Price Obsolete 256 bit 8 32X8 5 V 25 ns OTP ROM 1 32 1.024 k ASYNCHRONOUS 3-STATE PARALLEL 160 µA 5.25 V 4.75 V BIPOLAR MILITARY R-PDIP-T24 Not Qualified 125 °C -55 °C 24 PLASTIC/EPOXY DIP RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL 5.715 mm 32.004 mm 15.24 mm ADVANCED MICRO DEVICES INC DIP DIP, 24 unknown EAR99 8542.32.00.71
82S123/BEX
YAGEO Corporation
Check for Price Obsolete 256 bit 8 32X8 5 V 50 ns OTP ROM 1 32 32 words ASYNCHRONOUS PARALLEL 5.5 V 4.5 V BIPOLAR MILITARY R-CDIP-T16 Not Qualified 125 °C -55 °C 16 CERAMIC, METAL-SEALED COFIRED DIP RECTANGULAR IN-LINE NO THROUGH-HOLE DUAL PHILIPS COMPONENTS DIP DIP, 16 unknown EAR99 8542.32.00.71
AM27S184LC
AMD
Check for Price No No Obsolete 256 bit 8 32X8 5 V 55 ns OTP ROM 1 32 2.048 k ASYNCHRONOUS OPEN-COLLECTOR PARALLEL 5.25 V 4.75 V BIPOLAR COMMERCIAL EXTENDED R-CQCC-N28 Not Qualified e0 75 °C 28 CERAMIC, METAL-SEALED COFIRED QCCN LCC28,.35X.55 RECTANGULAR CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD 2.54 mm 13.97 mm 8.89 mm ADVANCED MICRO DEVICES INC QLCC QCCN, LCC28,.35X.55 28 unknown EAR99 8542.32.00.71
N82US23A
Signetics
Check for Price No Obsolete 8 32X8 5 V 13 ns OTP ROM 32 32 words 115 µA TTL COMMERCIAL S-PQCC-J20 Not Qualified e0 70 °C 20 PLASTIC/EPOXY QCCJ LDCC20,.4SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD SIGNETICS CORP QCCJ, LDCC20,.4SQ unknown EAR99 8542.32.00.71
HM9-7602-8
Harris Semiconductor
Check for Price No Obsolete 8 32X8 5 V 60 ns OTP ROM 32 32 words 130 µA TTL MILITARY R-XDFP-F16 Not Qualified e0 125 °C -55 °C MIL-STD-883 Class B (Modified) 16 CERAMIC DFP FL16,.3 RECTANGULAR FLATPACK YES Tin/Lead (Sn/Pb) FLAT 1.27 mm DUAL HARRIS SEMICONDUCTOR DFP, FL16,.3 unknown EAR99 8542.32.00.71
53S081L
Monolithic Memories (RETIRED)
Check for Price No Obsolete 256 bit 8 32X8 5 V 35 ns OTP ROM 1 32 32 words ASYNCHRONOUS PARALLEL 125 µA 5.5 V 4.5 V CMOS MILITARY S-MQCC-N20 Not Qualified e0 125 °C -55 °C 20 METAL QCCN LCC20,.35SQ SQUARE CHIP CARRIER YES TIN LEAD NO LEAD 1.27 mm QUAD MONOLITHIC MEMORIES unknown
5962-01-026-7942
AMD
Check for Price No Obsolete 8 32X8 5 V 40 ns OTP ROM 32 32 words 115 µA TTL COMMERCIAL R-XDIP-T16 Not Qualified 70 °C 16 CERAMIC DIP DIP16,.3 RECTANGULAR IN-LINE NO THROUGH-HOLE 2.54 mm DUAL ADVANCED MICRO DEVICES INC DIP, DIP16,.3 compliant EAR99 8542.32.00.71
DM74S188J/B+
Texas Instruments
Check for Price No Obsolete 8 32X8 5 V 35 ns OTP ROM 32 32 words 110 µA TTL COMMERCIAL R-XDIP-T16 Not Qualified e0 70 °C 16 CERAMIC DIP DIP16,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL NATIONAL SEMICONDUCTOR CORP DIP, DIP16,.3 unknown EAR99 8542.32.00.71