Parametric results for: FIFOs

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7201LA12SOG8
Integrated Device Technology Inc
$5.6700 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified e3 3 70 °C 260 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC PLASTIC, SOIC-28 28 PEG28 compliant EAR99 8542.32.00.71 1988-01-01
7201LA15JGI
Integrated Device Technology Inc
$5.6862 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 15 ns 40 MHz 25 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC GREEN, PLASTIC, LCC-32 32 PLG32 compliant EAR99 8542.32.00.71 1988-01-01
SN74ALVC7803-20DL
Texas Instruments
$5.7126 No Yes Obsolete 9.216 kbit 18 512X18 3.3 V 13 ns 50 MHz 20 ns OTHER FIFO 1 512 512 words SYNCHRONOUS 3-STATE YES PARALLEL 3.6 V 3.3 V CMOS COMMERCIAL R-PDSO-G56 Not Qualified e4 1 70 °C 260 30 56 PLASTIC/EPOXY SSOP SSOP56,.4 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 635 µm DUAL 2.79 mm 18.415 mm 7.5 mm TEXAS INSTRUMENTS INC SSOP 0.300 INCH, GREEN, SSOP-56 56 compliant EAR99 8542.32.00.71
72V01L15JG8
Integrated Device Technology Inc
$5.7378 Yes Yes Transferred 4.608 kbit 9 512X9 3.3 V 15 ns 25 ns OTHER FIFO 1 512 512 words ASYNCHRONOUS 3-STATE NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-N32 e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCN LCC32,.45X.55 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 2.79 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC LCC-32 32 PLG32 compliant EAR99 8542.32.00.71 1988-01-01
SN74ALVC7804-25DL
Texas Instruments
$5.8078 Yes Yes Active 9.216 kbit 18 512X18 3.3 V 22 ns 40 MHz 25 ns OTHER FIFO 1 512 512 words SYNCHRONOUS 3-STATE YES PARALLEL 40 nA 3.6 V 3.3 V CMOS COMMERCIAL R-PDSO-G56 Not Qualified e4 1 70 °C 260 30 56 PLASTIC/EPOXY SSOP SSOP56,.4 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 635 µm DUAL 2.79 mm 18.415 mm 7.5 mm TEXAS INSTRUMENTS INC SSOP SSOP, SSOP56,.4 56 compliant EAR99 8542.39.00.01 Texas Instruments
SN74ACT2228DW
Texas Instruments
$5.8120 Yes Yes Active 256 bit 1 256X1 5 V 20 ns 22 MHz 45.45 ns OTHER FIFO 2 256 256 words SYNCHRONOUS TOTEM POLE NO SERIAL 400 µA 400 nA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G24 Not Qualified e4 1 85 °C -40 °C 260 30 24 PLASTIC/EPOXY SOP SOP24,.4 RECTANGULAR SMALL OUTLINE YES NICKEL PALLADIUM GOLD GULL WING 1.27 mm DUAL 2.65 mm 15.4 mm 7.5 mm TEXAS INSTRUMENTS INC SOIC GREEN, PLASTIC, SOIC-24 24 compliant EAR99 8542.39.00.01 Texas Instruments
7201LA12JG
Integrated Device Technology Inc
$5.8139 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC GREEN, PLASTIC, LCC-32 32 PLG32 compliant EAR99 8542.32.00.71 1988-01-01
7201LA12PDG
Integrated Device Technology Inc
$5.8139 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e3 1 70 °C 260 30 28 PLASTIC/EPOXY DIP DIP28,.6 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 4.699 mm 36.576 mm 15.24 mm INTEGRATED DEVICE TECHNOLOGY INC PDIP DIP-28 28 PDG28 compliant EAR99 8542.32.00.71 1988-01-01
7200L12JG
Integrated Device Technology Inc
$5.8298 Yes Yes Transferred 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC GREEN, PLASTIC, LCC-32 32 PLG32 compliant EAR99 8542.32.00.71 1988-01-01
7200L15TPGI
Integrated Device Technology Inc
$5.8299 Yes Yes Transferred 2.304 kbit 9 256X9 5 V 15 ns 40 MHz 25 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PDIP-T28 Not Qualified e3 85 °C -40 °C 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 4.572 mm 34.671 mm 7.62 mm INTEGRATED DEVICE TECHNOLOGY INC DIP GREEN, PLASTIC, DIP-28 28 compliant EAR99 8542.32.00.71