Parametric results for: FIFOs

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7201LA15JG
Integrated Device Technology Inc
$5.2143 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 15 ns 40 MHz 25 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ GREEN, PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
7201LA12JG8
Integrated Device Technology Inc
$5.2620 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71 PLG32 1988-01-01
72V01L25JGI8
Integrated Device Technology Inc
$5.2620 Yes Yes Transferred 4.608 kbit 9 512X9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO 1 512 512 words ASYNCHRONOUS 3-STATE NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 85 °C -40 °C 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.556 mm 13.995 mm 11.455 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLCC-32 32 compliant EAR99 8542.32.00.71
7201LA15JGI8
Integrated Device Technology Inc
$5.2620 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 15 ns 40 MHz 25 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71 PLG32 1988-01-01
7200L12JG8
Integrated Device Technology Inc
$5.2764 Yes Yes Transferred 2.304 kbit 9 256X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 256 256 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC PLCC GREEN, PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71 PLG32 1988-01-01
IDT7202LA35SO
Integrated Device Technology Inc
$5.2992 No No Obsolete 9.216 kbit 9 1KX9 5 V 35 ns 22.2 MHz 45 ns OTHER FIFO RETRANSMIT 1 1000 1.024 k ASYNCHRONOUS 3-STATE NO PARALLEL 500 µA 125 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified e0 3 70 °C 225 30 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn85Pb15) GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC SOIC-28 28 not_compliant EAR99 8542.32.00.71
SN74ALVC7805-40DLR
Texas Instruments
$5.4886 Yes Yes Obsolete 4.608 kbit 18 256X18 3.3 V 20 ns 50 MHz 40 ns OTHER FIFO 1 256 256 words SYNCHRONOUS 3-STATE YES PARALLEL 40 nA 3.6 V 3 V CMOS COMMERCIAL R-PDSO-G56 Not Qualified e4 1 70 °C 260 30 56 PLASTIC/EPOXY SSOP SSOP56,.4 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 635 µm DUAL 2.79 mm 18.415 mm 7.5 mm TEXAS INSTRUMENTS INC SSOP 0.300 INCH, 0.635 MM PITCH, GREEN, PLASTIC, SSOP-56 56 compliant EAR99 8542.39.00.01 Texas Instruments
7202LA25JGI
Integrated Device Technology Inc
$5.5861 Yes Yes Transferred 9.216 kbit 9 1KX9 5 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 1000 1.024 k ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ GREEN, PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
7201LA12TPG
Integrated Device Technology Inc
$5.6310 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 12 ns 50 MHz 20 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5 mA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDIP-T28 Not Qualified e3 1 70 °C 260 28 PLASTIC/EPOXY DIP DIP28,.3 RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 4.572 mm 34.671 mm 7.62 mm INTEGRATED DEVICE TECHNOLOGY INC PDIP GREEN, PLASTIC, DIP-28 28 compliant EAR99 8542.32.00.71 PTG28 1988-01-01
7201LA15SOGI8
Integrated Device Technology Inc
$5.6700 Yes Yes Transferred 4.608 kbit 9 512X9 5 V 15 ns 25 ns RETRANSMIT 1 512 512 words ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS INDUSTRIAL R-PDSO-G28 Not Qualified e3 3 85 °C -40 °C 260 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC PLASTIC, SOIC-28 28 compliant EAR99 8542.32.00.71 PEG28