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Select Parts | Part Number |
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M24C04-WMN6P
STMicroelectronics
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93AA76C-I/P
Microchip Technology Inc
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24C01CT-I/OT
Microchip Technology Inc
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M24C64-RDW6TP
STMicroelectronics
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M24C32-RMN6TP
STMicroelectronics
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M24C04-WMN6TP
STMicroelectronics
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M24C04-FMN6TP
STMicroelectronics
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M24C02-RMC6TG
STMicroelectronics
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24LC00/P
Microchip Technology Inc
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M24C08-RDW6TP
STMicroelectronics
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Most Relevant | Technical | Compliance | Operating Conditions | Physical | Dimensions | Other | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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Composite Price
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Pbfree Code
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Rohs Code
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Part Life Cycle Code
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Memory Density
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Memory Width | Organization |
Supply Voltage-Nom (Vsup)
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Clock Frequency-Max (fCLK) |
Memory IC Type
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Alternate Memory Width
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Data Retention Time-Min
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Endurance
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I2C Control Byte
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Number of Functions | Number of Ports | Number of Words Code | Number of Words |
Operating Mode
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Output Characteristics
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Parallel/Serial
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Programming Voltage
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Ready/Busy
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Reverse Pinout
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Serial Bus Type
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Standby Current-Max
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Supply Current-Max
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Supply Voltage-Max (Vsup)
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Supply Voltage-Min (Vsup)
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Technology |
Temperature Grade
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Toggle Bit
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Write Cycle Time-Max (tWC)
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Write Protection
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JESD-30 Code
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Qualification Status
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JESD-609 Code
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Moisture Sensitivity Level
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Operating Temperature-Max
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Operating Temperature-Min
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Peak Reflow Temperature (Cel)
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Screening Level
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Time@Peak Reflow Temperature-Max (s)
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Number of Terminals
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Package Body Material
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Package Code
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Package Equivalence Code
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Package Shape
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Package Style
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Surface Mount
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Terminal Finish
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Terminal Form
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Terminal Pitch
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Terminal Position
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Seated Height-Max
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Length
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Width
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Ihs Manufacturer
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Part Package Code
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Package Description
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Pin Count
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Reach Compliance Code
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ECCN Code
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HTS Code
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Samacsys Manufacturer
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Date Of Intro
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Yes | Obsolete | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||
Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 1 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.27 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||
Yes | Active | 1.024 kbit | 8 | 128X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 128 | 128 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 5 µA | 3 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 1 ms | R-PDSO-G6 | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 6 | PLASTIC/EPOXY | LSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 950 µm | DUAL | 1.45 mm | 2.9 mm | 1.55 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||||||
Yes | Active | 65.536 kbit | 8 | 8KX8 | 2.5 V | EEPROM | 1000000 Write/Erase Cycles | 1 | 8000 | 8.192 k | SYNCHRONOUS | SERIAL | 1 µA | 2.5 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | SOIC | TSSOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | ||||||||||||||||
Yes | Active | 32.768 kbit | 8 | 4KX8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 4000 | 4.096 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 5 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | SOP-8 | 8 | compliant | STMicroelectronics | ||||||||||||
Yes | Not Recommended | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | 1980-01-04 | ||||||||||
Yes | Active | 4.096 kbit | 8 | 512X8 | 2.5 V | 400 kHz | EEPROM | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOP-8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | ||||||||||||||||||||||||
Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | STMICROELECTRONICS | SOIC | 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||
Yes | Yes | Active | 128 bit | 8 | 16X8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXXR | 1 | 1 | 16 | 16 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | I2C | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | COMMERCIAL | 4 ms | R-PDIP-T8 | Not Qualified | e3 | 70 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.32 mm | 9.46 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH , LEAD FREE, PLASTIC, MS-001, DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||||
Yes | Active | 8.192 kbit | 8 | 1KX8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DMMR | 1 | 1000 | 1.024 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | SOIC | TSSOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics |
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M24C04-WMN6P
STMicroelectronics
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$0.0441 Buy | Yes | Obsolete | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | ||||||||||||
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93AA76C-I/P
Microchip Technology Inc
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$0.0476 Buy | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 1 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | Matte Tin (Sn) | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.27 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||
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24C01CT-I/OT
Microchip Technology Inc
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$0.0631 Buy | Yes | Active | 1.024 kbit | 8 | 128X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 128 | 128 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 5 µA | 3 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 1 ms | R-PDSO-G6 | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 6 | PLASTIC/EPOXY | LSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 950 µm | DUAL | 1.45 mm | 2.9 mm | 1.55 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||||||
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M24C64-RDW6TP
STMicroelectronics
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$0.0640 Buy | Yes | Active | 65.536 kbit | 8 | 8KX8 | 2.5 V | EEPROM | 1000000 Write/Erase Cycles | 1 | 8000 | 8.192 k | SYNCHRONOUS | SERIAL | 1 µA | 2.5 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | SOIC | TSSOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||||||||
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M24C32-RMN6TP
STMicroelectronics
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$0.0698 Buy | Yes | Active | 32.768 kbit | 8 | 4KX8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 4000 | 4.096 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 5 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | SOP-8 | 8 | compliant | STMicroelectronics | |||||||||||||
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M24C04-WMN6TP
STMicroelectronics
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$0.0721 Buy | Yes | Not Recommended | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 40 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | 1980-01-04 | |||||||||||
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M24C04-FMN6TP
STMicroelectronics
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$0.0760 Buy | Yes | Active | 4.096 kbit | 8 | 512X8 | 2.5 V | 400 kHz | EEPROM | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 5.5 V | 1.7 V | CMOS | INDUSTRIAL | 5 ms | R-PDSO-G8 | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOP-8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||||||||||||||||
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M24C02-RMC6TG
STMicroelectronics
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$0.0827 Buy | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | STMICROELECTRONICS | SOIC | 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | ||||||||||||
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24LC00/P
Microchip Technology Inc
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$0.0847 Buy | Yes | Yes | Active | 128 bit | 8 | 16X8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010XXXR | 1 | 1 | 16 | 16 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | I2C | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | COMMERCIAL | 4 ms | R-PDIP-T8 | Not Qualified | e3 | 70 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.32 mm | 9.46 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH , LEAD FREE, PLASTIC, MS-001, DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||||||
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M24C08-RDW6TP
STMicroelectronics
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$0.0858 Buy | Yes | Active | 8.192 kbit | 8 | 1KX8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DMMR | 1 | 1000 | 1.024 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | STMICROELECTRONICS | SOIC | TSSOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics |