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M24C02-RMN6TP
STMicroelectronics
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$0.0292 | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||||
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M24C01-RMN6TP
STMicroelectronics
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$0.0338 | Yes | Active | 1.024 kbit | 8 | 128X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 128 | 128 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||||
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93AA76C-I/P
Microchip Technology Inc
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$0.0476 | Yes | Yes | Active | 8.192 kbit | 16 | 512X16 | 2.5 V | 1 MHz | EEPROM | 8 | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 512 | 512 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 1 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | YES | 5 ms | SOFTWARE | R-PDIP-T8 | Not Qualified | e3 | 85 °C | -40 °C | TS 16949 | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 5.334 mm | 9.27 mm | 7.62 mm | MICROCHIP TECHNOLOGY INC | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||
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93C66BT-E/SN
Microchip Technology Inc
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$0.0601 | Yes | Yes | Active | 4.096 kbit | 16 | 256X16 | 2.5 V | 1 MHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1 | 1 | 256 | 256 words | SYNCHRONOUS | TOTEM POLE | SERIAL | YES | NO | MICROWIRE | 5 µA | 2 µA | 5.5 V | 1.8 V | CMOS | AUTOMOTIVE | YES | 2 ms | SOFTWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | TS 16949 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | MATTE TIN | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||||||
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24C01CT-I/OT
Microchip Technology Inc
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$0.0631 | Yes | Active | 1.024 kbit | 8 | 128X8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 128 | 128 words | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 5 V | I2C | 5 µA | 3 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | 1 ms | R-PDSO-G6 | e3 | 1 | 85 °C | -40 °C | 260 | TS 16949 | 40 | 6 | PLASTIC/EPOXY | LSSOP | TSOP6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 950 µm | DUAL | 1.45 mm | 2.9 mm | 1.55 mm | MICROCHIP TECHNOLOGY INC | SOT-23, 6 PIN | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||||||
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M24C04-WMN6P
STMicroelectronics
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$0.0654 | Yes | Obsolete | 4.096 kbit | 8 | 512X8 | 5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDMR | 1 | 512 | 512 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 2.5 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SOP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||||
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M24C32-RMN6TP
STMicroelectronics
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$0.0698 | Yes | Active | 32.768 kbit | 8 | 4KX8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 4000 | 4.096 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 5 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | AEC-Q100 | NOT SPECIFIED | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | STMICROELECTRONICS | SOIC | SOP-8 | 8 | compliant | STMicroelectronics | ||||||||||||||
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M24C02-RMC6TG
STMicroelectronics
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$0.0726 | Yes | Active | 2.048 kbit | 8 | 256X8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | I2C | 1 µA | 2 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | STMICROELECTRONICS | SOIC | 2 X 3 MM, HALOGEN FREE AND ROHS COMPLIANT, MLP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics | |||||||||||||
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CAT93C66VI-GT3
onsemi
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$0.0780 | Yes | Active | 4.096 kbit | 16 | 256X16 | 5 V | 2 MHz | EEPROM | 100 YEAR DATA RETENTION | 8 | 100 | 1000000 Write/Erase Cycles | 1 | 256 | 256 words | SYNCHRONOUS | SERIAL | MICROWIRE | 10 µA | 3 µA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | SOFTWARE | R-PDSO-G8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | GULL WING | 1.27 mm | DUAL | 1.75 mm | 4.9 mm | 3.9 mm | ONSEMI | SOIC 8, 150 mils | 0.150 INCH, HALOGEN FREE AND ROHS COMPLIANT, MS-012, SOIC-8 | 8 | compliant | EAR99 | 8542.32.00.51 | onsemi | 751BD | ||||||||||||
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M24C08-RMC6TG
STMicroelectronics
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$0.0864 | Yes | Active | 8.192 kbit | 8 | 1KX8 | 2.5 V | 400 kHz | EEPROM | 40 | 1000000 Write/Erase Cycles | 1010DMMR | 1 | 1000 | 1.024 k | SYNCHRONOUS | SERIAL | I2C | 1 µA | 800 nA | 5.5 V | 1.8 V | CMOS | INDUSTRIAL | 5 ms | HARDWARE | R-PDSO-N8 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 600 µm | 3 mm | 2 mm | STMICROELECTRONICS | SOIC | MLP-8 | 8 | compliant | EAR99 | 8542.32.00.51 | STMicroelectronics |