Parametric results for: 3pe-50 under Delay Lines

BOTH LEADING & TRAILING EDGE ACCURACY 202 BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT 1,141 BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 LS LOAD PER OUTPUT 117 BOTH LEADING & TRAILING EDGE ACCURACY; MAX RISE TIME CAPTURED 138 BURNED-IN TO LEVEL B OF MIL-STD-883; MAX RISE TIME CAPTURED 154 BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 50MA; MAX RISE TIME CAPTURED 90 BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 60MA; MAX RISE TIME CAPTURED 427 BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 65MA; MAX RISE TIME CAPTURED 84 CAN BE OPERATED ON +5V VCC 154 IMPEDANCE TOL. 10%; INPUT RISE TIME 3NS; TYP. ATTENUATION 10%; MAX RISE TIME CAPTURED 132 IMPEDANCE TOL. 10%; MAX DISTORTION 10%; MAX ATTENUATION 1DB; MAX TEMP. COEFF. CAPTURED 450 IN-HOUSE BURN-IN AND THERMAL SHOCK; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. 372 INPUT & OUTPUT ENABLES; TYP. ICC = 60MA; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 96 INPUT RISE TIME 1NS 214 INPUT RISE TIME 3NS; MAX RISE TIME CAPTURED 194 INPUT TO 1ST TAP DELAY = 3.5+-1NS 80 LENGTH_MAX 2,652 LENGTH_MAX, WIDTH_MAX, SEATED HT_CALCULATED 3,978 LG-MAX 153 LG_MAX 240 LG_MAX, WD_MAX 439 MAX RISE TIME CAPTURED 14,304 MAX WORKING VOLTAGE 25VDC; IMPEDANCE TOL. 5%; TYP. DISTORTION 3%; MAX RISE TIME CAPTURED 158 MAX WORKING VOLTAGE 25VDC; MIN. DIELECTRIC STRENGTH 100VDC; IMPEDANCE TOL. 5% 774 MEETS MIL-D-23859 426 MEETS MIL-D-23859; IMPEDANCE TOL. 10%; INPUT RISE TIME 3NS; MAX ATTENUATION 10% 162 MEETS MIL-D-23859; IMPEDANCE TOL. 10%; INPUT RISE TIME 3NS; MAX RISE TIME & TEMP. COEFF. CAPTURED 104 MEETS MIL-D-23859; IMPEDANCE TOL. 10%; MAX DISTORTION 5%; MAX RISE TIME AND TEMP. COEFF. CAPTURED 1,036 MEETS MIL-D-23859; IN-HOUSE BURN-IN AND THERMAL SHOCK; COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. 192 MEETS MIL-D-23859; INPUT RISE TIME 3NS; TYP. ATTENUATION 10%; MAX TEMP. COEFF. CAPTURED 115 MEETS MIL-D-23859; MAX DISTORTION 5%; MAX RISE TIME AND TEMP. COEFF. CAPTURED 246 MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. 508 MEETS MIL-D-23859C; DIELECTRIC STRENGTH 50VDC; MAX DISTORTION 10% 245 MEETS MIL-D-23859C; IMPEDANCE TOL. 10% 219 MIN. FAN OUT OF 10 LSTTL LOADS 85 OUTPUT PULSE WIDTH TOL. = +-1.5NS OR 5%, WHICHEVER IS GREATER; MAX RISE TIME CAPTURED 80 OUTPUT PULSE WIDTH TOL. = +-1NS; TYP. ICC = 30MA; MAX RISE TIME CAPTURED 360 OUTPUT PULSE WIDTH TOL. = +-2NS; TYP. ICC = 30MA; MAX RISE TIME CAPTURED 96 TAP TO TAP DELAY TOL.[NS] VARIES; BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 60MA 151 TAP TO TAP DELAY TOL.[NS] VARIES; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 572 TESTED WITH NO LOAD CONDITIONS 86 TYP. ICC = 30MA; MAX FAN OUT OF 8 TTL LOAD PER OUTPUT; MAX TEMP. COEFF. CAPTURED 80 TYP. ICC = 35MA; MAX FAN OUT OF 10 STTL LOAD PER OUTPUT; INTERNAL TERMINATION 192 TYP. ICC = 40MA; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 510 TYP. ICC = 40MA; MAX FAN OUT OF 10 TTL LOAD PER OUTPUT; MAX RISE TIME CAPTURED 92 TYP. ICC = 60MA; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 90 TYP. ICC = 60MA; MAX FAN OUT OF 10 STTL LOAD PER OUTPUT; INTERNAL TERMINATION 336 TYP. ICC = 85MA; INTERNAL TERMINATION; MAX RISE TIME CAPTURED 456 WD-MAX 111 WITH EBAR 219

SQUARE 78

0805 884 1000 397 100K 519 1013 172 10H 674 10K 997 1100 388 1135 132 1405 1,285 1410 686 1516 2,530 1518 233 1520 7,956 3D 146 7SIPF 132 9910 140 A04 420 A08 167 ACT 382 AIK 207 AIL 207 AIU 276 AIV 207 AIY 276 AIZ 273 AMY 235 AMZ 237 CMOS 636 CMOS/TTL 1,665 DDU 225 ECL 169 EPA 264 F 6,664 F/FAST 1,447 GL1L 199 HC/UH 780 L33 132 L52 230 LS 626 LVC/LCX/Z 204 P01 273 P1410 140 S 612 SIP 195 SMP1410 405 SMP1610 270 SMWD 376 TTL 5,449 TTL/H/L 164 WS 188

610.49 Hz 1 1.2209 kHz 1 2.4418 kHz 1 4.8832 kHz 1 12.2052 kHz 1 1.25 MHz 3 1.5625 MHz 2 1.6667 MHz 2 1.8182 MHz 2 1.8868 MHz 2 2.2222 MHz 3 2.5 MHz 8 2.6385 MHz 2 2.9762 MHz 2 3.125 MHz 8 3.2363 MHz 2 3.3333 MHz 7 3.6364 MHz 4 4 MHz 2 4.1667 MHz 4 4.6296 MHz 2 5 MHz 8 5.5556 MHz 3 5.9172 MHz 2 6.25 MHz 9 6.6667 MHz 4 6.7797 MHz 3 8.3333 MHz 7 10 MHz 3 10.101 MHz 2 10.3627 MHz 2 10.4167 MHz 3 11.1111 MHz 5 12.5 MHz 4 14.2857 MHz 2 15.625 MHz 3 16.6667 MHz 3 20 MHz 4 23.2558 MHz 2 25 MHz 8 27.7778 MHz 3 30.7692 MHz 2 33.3333 MHz 4 55.5556 MHz 2 83.3333 MHz 2 92.5926 MHz 2 103.52 MHz 3 122.549 MHz 3 125 MHz 67 200 MHz 2

R-CDIP-T8 394 R-CDIP-T9 230 R-PDIP-P4 515 R-PDIP-P8 239 R-PDIP-T14 4,825 R-PDIP-T16 590 R-PDIP-T24 445 R-PDIP-T4 806 R-PDIP-T5 221 R-PDIP-T6 482 R-PDIP-T8 4,901 R-PDIP-T9 447 R-PDSO-C8 397 R-PDSO-G14 3,702 R-PDSO-G16 1,781 R-PDSO-G4 564 R-PDSO-G6 230 R-PDSO-G8 3,209 R-PDSO-J14 476 R-PDSO-J8 607 R-PSIP-T3 328 R-PSIP-T4 611 R-PSIP-T7 202 R-PSIP-T8 502 R-XDIP-P4 470 R-XDIP-P8 335 R-XDIP-T14 5,623 R-XDIP-T16 244 R-XDIP-T24 325 R-XDIP-T4 437 R-XDIP-T8 2,677 R-XDIP-T9 391 R-XDSO-G14 4,712 R-XDSO-G16 323 R-XDSO-G24 485 R-XDSO-G4 920 R-XDSO-G8 2,140 R-XDSO-J14 250 R-XDSO-J4 698 R-XDSO-J8 386 R-XDSO-L4 510 R-XDSO-L8 210 R-XSIP-T14 226 R-XSIP-T3 494 R-XSIP-T4 624 R-XSIP-T8 372 S-PDSO-G8 317 S-XDFP-F14 223 S-XDSO-G14 218 X-XUUC-N 198

e0 12,395 e0/e3 850 e1 84 e3 10,858 e4 99

3 mm 353 3.2 mm 104 4.88 mm 171 4.9 mm 585 5 mm 159 6.35 mm 86 8.695 mm 158 9.375 mm 355 9.65 mm 117 9.9 mm 99 10.1 mm 101 10.16 mm 548 10.3 mm 333 10.335 mm 152 11.43 mm 753 12.45 mm 376 12.7 mm 6,724 12.8 mm 530 12.82 mm 160 12.83 mm 774 12.95 mm 365 12.954 mm 84 13 mm 104 13.2 mm 1,273 18.54 mm 132 19.05 mm 479 19.304 mm 297 19.305 mm 569 19.43 mm 2,028 19.81 mm 172 19.812 mm 4,445 19.94 mm 954 20.06 mm 4,020 20.3 mm 2,027 20.32 mm 3,653 20.6 mm 373 22.098 mm 122 22.352 mm 356 22.86 mm 338 31.75 mm 232 32.258 mm 471 32.3 mm 104 32.512 mm 494 33.02 mm 154 37.3 mm 104 40.64 mm 244 41.91 mm 351 44.45 mm 98 52.832 mm 199 62.23 mm 124

2 pF 7 5 pF 9 10 pF 2,238 11 pF 724 15 pF 1,691 25 pF 81 50 pF 108

ACTIVE DELAY LINE 26,253 PASSIVE DELAY LINE 23,223 PULSE DISCRIMINATOR DELAY LINE 342 PULSE GENERATOR DELAY LINE 3,527 SILICON DELAY LINE 4,725

Allegro MicroSystems LLC 1 Allen Avionics Inc 328 Analog Devices Inc 209 Anaren Microwave 18 Atmel Corporation 1 Bel Fuse 2,147 C&D Technologies Inc 183 Conexant Systems Inc 9 Dallas Semiconductor 1,437 Data Delay Devices Inc 19,104 Data Translation Inc 4 Datatronic Distribution Inc 276 E-San Electronic Co Ltd 56 ELMEC Technology Of America Inc 247 Engineered Components Co 9,584 Esc Electronics Corp 2,450 Floeth Electronic Ltd 1 Freescale Semiconductor 5 Inland Motor 2 iNRCORE LLC 1 Integrated Device Technology Inc 3 Kappa Networks Inc 269 Lexor 112 Linear Technology 44 LSI Computer Systems Inc 4 LSI Corporation 1 MACOM 3 Manutech Inc 1 Maxim Integrated Products 2,297 Micrel Inc 43 Microchip Technology Inc 71 Microsemi Corporation 27 Motorola Mobility LLC 9 Motorola Semiconductor Products 9 Murata Connectivity 7 Murata Manufacturing Co Ltd 78 Murata Power Solutions 205 Natel Engineering Company 23 Nippon Precision Circuits Inc 1 NXP Semiconductors 5 onsemi 51 PCA Electronics Inc 3,485 Philips Semiconductors 1 Polara Engineering Inc 478 Princeton Advanced Components Inc 19 Pulse Electronics Corporation 755 RCD Components Inc 10,541 Renesas Electronics Corporation 2 Rhombus Industries Inc 6,199 Rochester Electronics LLC 302 Seiko NPC Corporation 1 Semtech Corporation 11 Sensata Circuit Breakers 2 Shanghai Belling Co Ltd 4 Signal Technology Corp 57 Signetics 1 Sixnet 1,437 Sony Semiconductor 8 Spectrum Microwave 2 STMicroelectronics 1 Susumu Co Ltd 484 Synergy Semiconductor Corp 8 TDK Corporation 51 TE Connectivity 2 Technitrol Inc 244 Telefunken Microelectronics Gmbh 1 Temic Semiconductors 2 Texas Instruments 31 Thin Film Technology Corp (TFT) 695 TOKO Inc 29 TriQuint Semiconductor 2 TTM Technologies 10 Unicom Electronic Corp 79 Universal Microelectronics Co Ltd 185 Valor 33 Walmsley Microsystems Ltd 1 Yuan Dean Scientific Co Ltd 345

24 mA 3

1 2,066 2 95 3 2,200 4 303 NOT APPLICABLE 36 NOT SPECIFIED 116

1.0 51,806 2.0 2,083 3.0 3,922 4.0 1,133 5.0 13 6.0 18 7.0 147 8.0 36

0 88 1 16,824 2 1,034 3 675 4 755 5 16,444 6 1 7 1,245 8 376 9 1 10 17,216 12 99 14 199 15 837 16 70 20 609 23 3 31 217 63 371 99 6 127 161 255 637 508 2 511 4 1023 118 4095 88 8191 2

10 175 11 53 12 226 13 743 14 20,822 15 374 16 3,101 17 187 176 1 18 118 19 69 2 16 20 139 22 5 24 1,477 28 190 3 1,101 32 208 36 8 4 6,757 40 433 44 13 48 22 5 949 6 1,772 64 21 7 533 8 17,992 9 1,416 90 5

70.0 °C 26,255 75.0 °C 378 80.0 °C 85 85.0 °C 8,025 100.0 °C 2 125.0 °C 19,536 140.0 °C 2

-85.0 °C 17 -65.0 °C 65 -55.0 °C 19,442 -54.0 °C 1 -40.0 °C 5,958 -30.0 °C 1,107 -25.0 °C 272 -20.0 °C 7 -10.0 °C 94 0.0 °C 27,320

OPEN-EMITTER 2,314

50 Ω 6,538 55 Ω 199 65 Ω 60 75 Ω 1,043 80 Ω 50 82 Ω 22 93 Ω 159 100 Ω 5,704 150 Ω 6 170 Ω 50 200 Ω 4,609 250 Ω 63 300 Ω 2,572 350 Ω 136 360 Ω 24 400 Ω 40 500 Ω 2,692

COMPLEMENTARY 3,321 INVERTED 630 TRUE 52,171

CERAMIC 209 CERAMIC, GLASS-SEALED 4 CERAMIC, METAL-SEALED COFIRED 1,313 METAL 88 PLASTIC/EPOXY 30,279 UNSPECIFIED 27,160

BGA 343 DFP 316 DIE 269 DIP 26,838 DMA 14 FBGA 1 HTQFP 8 HVQCCN 30 HVSON 48 LBGA 9 LFQFP 2 LQFP 28 LSOP 7 LSSOP 7 QCCJ 182 QCCN 26 QFF 2 QFP 45 QIP 1,359 SIP 4,393 SOC 801 SOJ 3,158 SOL 1,158 SON 80 SOP 19,207 SSOP 6 TBGA 26 TQFP 42 TSOP 4 TSSOP 467 VBGA 66 VFBGA 22 VQCCN 42 VSON 5 VSSOP 56

DIE OR CHIP 247 DIP14(UNSPEC) 81 DIP14,.3 9,559 DIP16,.3 1,306 DIP24,.3 96 DIP24,.4 187 DIP24,.6 124 DIP32,.3 392 DIP4/14,.3 324 DIP4/8,.3 374 DIP40,.6 190 DIP48,.3 132 DIP6/16,.3 84 DIP8(UNSPEC) 404 DIP8,.3 3,311 DIP8/14,.3 620 DIP8/16,.3 176 DIP9/16,.3 86 GWDIP14,.3 195 GWDIP14,.4 2,903 GWDIP16,.9 304 GWDIP24,.9 228 GWDIP4/14,.5 91 GWDIP4/8,.5 389 GWDIP8,.3 123 GWDIP8,.4 1,049 GWDIP8,.45 607 LDCC28,.5SQ 86 SIP3,.04 101 SIP4/5,.1 163 SIP8(UNSPEC) 380 SIP8,.06 319 SMDIP14,.3 242 SMDIP4/14,.44 91 SMDIP4/8,.33 85 SMDIP4/8,.38 352 SMDIP4/8,.4 85 SMDIP4/8,.44 352 SMDIP8,.3 501 SOC14,.5 171 SOC8/14,.5 256 SOP14,.25 181 SOP14,.3 202 SOP14,.4 2,828 SOP14,.65 92 SOP16,.25 104 SOP16,.4 446 SOP8,.25 687 SOP8/14,.4 480 TSSOP8,.19 291

RECTANGULAR 57,443 SQUARE 1,390 UNSPECIFIED 251

CHIP CARRIER 213 CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE 25 CHIP CARRIER, VERY THIN PROFILE 42 FLATPACK 361 FLATPACK, HEAT SINK/SLUG, THIN PROFILE 8 FLATPACK, LOW PROFILE 28 FLATPACK, LOW PROFILE, FINE PITCH 2 FLATPACK, THIN PROFILE 42 GRID ARRAY 343 GRID ARRAY, FINE PITCH 1 GRID ARRAY, LOW PROFILE 9 GRID ARRAY, THIN PROFILE 26 GRID ARRAY, VERY THIN PROFILE 66 GRID ARRAY, VERY THIN PROFILE, FINE PITCH 22 IN-LINE 32,344 MICROELECTRONIC ASSEMBLY 463 SMALL OUTLINE 24,245 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 36 SMALL OUTLINE, LOW PROFILE 7 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 7 SMALL OUTLINE, SHRINK PITCH 6 SMALL OUTLINE, THIN PROFILE 4 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 467 SMALL OUTLINE, VERY THIN PROFILE 5 SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH 44 UNCASED CHIP 269

BULK 2,696 RAIL 1 TR 336 TR, 7 INCH 8 TRAY 7 TUBE 117

4.72 ns 55 5 ns 83 6 ns 97 7 ns 69 8 ns 99 9 ns 78 10 ns 237 11 ns 59 12 ns 143 13 ns 62 14 ns 86 15 ns 190 16 ns 81 17 ns 68 18 ns 85 19 ns 53 20 ns 305 21 ns 87 22 ns 86 23 ns 61 24 ns 75 25 ns 409 30 ns 342 35 ns 249 40 ns 331 42 ns 49 45 ns 230 50 ns 464 55 ns 60 60 ns 315 65 ns 57 70 ns 119 75 ns 388 80 ns 140 85 ns 50 90 ns 84 100 ns 478 125 ns 292 150 ns 386 175 ns 227 200 ns 421 225 ns 73 250 ns 387 300 ns 231 350 ns 136 400 ns 189 450 ns 116 500 ns 284 750 ns 54 1 µs 73

-5.2 V 235 -5 V 207 -4.5 V 128 1.5 V 8 2.5 V 60 3 V 129 3.3 V 1,759 5 V 30,565 5.2 V 3 30 V 57

NO 32,663 YES 26,488

4 ns 236 5 ns 833 6 ns 514 7 ns 456 7.5 ns 177 8 ns 547 9 ns 459 10 ns 1,503 11 ns 254 12 ns 463 13 ns 248 14 ns 292 15 ns 1,062 16 ns 342 17 ns 180 18 ns 225 20 ns 2,098 24 ns 186 25 ns 1,831 30 ns 2,023 35 ns 906 40 ns 2,168 45 ns 1,020 50 ns 2,777 55 ns 185 60 ns 2,272 70 ns 612 75 ns 2,383 80 ns 978 90 ns 546 100 ns 2,760 110 ns 226 120 ns 767 125 ns 1,243 150 ns 2,189 175 ns 581 180 ns 810 200 ns 2,253 220 ns 624 225 ns 240 250 ns 1,957 300 ns 1,350 350 ns 385 375 ns 521 400 ns 591 450 ns 337 500 ns 1,436 600 ns 441 750 ns 412 1 µs 502