Part Details for WS57C256F-35D by Waferscale Integration Inc
Overview of WS57C256F-35D by Waferscale Integration Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WS57C256F-35D
WS57C256F-35D CAD Models
WS57C256F-35D Part Data Attributes:
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WS57C256F-35D
Waferscale Integration Inc
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Datasheet
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WS57C256F-35D
Waferscale Integration Inc
UVPROM, 32KX8, 35ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WAFERSCALE INTEGRATION INC | |
| Package Description | 0.600 INCH, CERDIP-28 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 35 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.0005 A | |
| Supply Current-Max | 0.164 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for WS57C256F-35D
This table gives cross-reference parts and alternative options found for WS57C256F-35D. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS57C256F-35D, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C64-150DCB | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | WS57C256F-35D vs AM27C64-150DCB |
| HY27UF084G2-TPIP | Flash, 512MX8, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48 | SK Hynix Inc | WS57C256F-35D vs HY27UF084G2-TPIP |
| 28LV64A-T-20/SO | 8K X 8 EEPROM 3V, 200 ns, PDSO28, PLASTIC, SOIC-28 | Microchip Technology Inc | WS57C256F-35D vs 28LV64A-T-20/SO |
| CY27C256A-120JC | OTP ROM, 32KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | WS57C256F-35D vs CY27C256A-120JC |
| AM27C64-250DI | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | WS57C256F-35D vs AM27C64-250DI |
| AM28F010-70EI | Flash, 128KX8, 70ns, PDSO32, TSOP-32 | Rochester Electronics LLC | WS57C256F-35D vs AM28F010-70EI |
| M27C405-150B1 | 512KX8 OTPROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | STMicroelectronics | WS57C256F-35D vs M27C405-150B1 |
| WS57C256F-70T | 32KX8 UVPROM, 70ns, CDIP28, 0.300 INCH, CERDIP-28 | STMicroelectronics | WS57C256F-35D vs WS57C256F-70T |
| MX23C2000MC-70 | MASK ROM, 256KX8, 70ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 | Macronix International Co Ltd | WS57C256F-35D vs MX23C2000MC-70 |
| AT27C512R-55DI | UVPROM, 64KX8, 55ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Atmel Corporation | WS57C256F-35D vs AT27C512R-55DI |