WS57C256F-35D vs AM27C64-150DCB feature comparison

WS57C256F-35D Waferscale Integration Inc

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AM27C64-150DCB Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer WAFERSCALE INTEGRATION INC ROCHESTER ELECTRONICS LLC
Package Description 0.600 INCH, CERDIP-28 DIP,
Reach Compliance Code unknown unknown
Access Time-Max 35 ns 150 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-CDIP-T28
JESD-609 Code e0
Memory Density 262144 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 8192 words
Number of Words Code 32000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified
Standby Current-Max 0.0005 A
Supply Current-Max 0.164 mA 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8542.32.00.61

Compare WS57C256F-35D with alternatives

Compare AM27C64-150DCB with alternatives