Part Details for W55F05 by Winbond Electronics Corp
Overview of W55F05 by Winbond Electronics Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for W55F05
W55F05 CAD Models
W55F05 Part Data Attributes:
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W55F05
Winbond Electronics Corp
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Datasheet
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W55F05
Winbond Electronics Corp
Flash, 512KX1, PDIP8, DIP-8
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | DIP | |
| Package Description | DIP, DIP8(UNSPEC) | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 1 MHz | |
| Data Retention Time-Min | 10 | |
| Endurance | 10000 Write/Erase Cycles | |
| JESD-30 Code | R-PDIP-T8 | |
| JESD-609 Code | e3 | |
| Memory Density | 524288 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX1 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8(UNSPEC) | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.000004 A | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 2.4 V | |
| Supply Voltage-Nom (Vsup) | 4.5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | DUAL | |
| Type | NOR TYPE |
Alternate Parts for W55F05
This table gives cross-reference parts and alternative options found for W55F05. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W55F05, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CAT25020L-1.8REV-B | EEPROM, 256X8, Serial, CMOS, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8 | Catalyst Semiconductor | W55F05 vs CAT25020L-1.8REV-B |
| CAT25020VI-TE13REV-B | EEPROM, 256X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, SOIC-8 | Catalyst Semiconductor | W55F05 vs CAT25020VI-TE13REV-B |
| CAT25020SI | 256X8 SPI BUS SERIAL EEPROM, PDSO8, SOIC-8 | onsemi | W55F05 vs CAT25020SI |
| CAT25020P-REV-B | EEPROM, 256X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | Catalyst Semiconductor | W55F05 vs CAT25020P-REV-B |
| CAT25020VA | IC 256 X 8 SPI BUS SERIAL EEPROM, PDSO8, LEAD AND HALOGEN FREE, SOIC-8, Programmable ROM | onsemi | W55F05 vs CAT25020VA |
| CAT25020VA-REV-C | IC 256 X 8 SPI BUS SERIAL EEPROM, PDSO8, ROHS COMPLIANT, SOIC-8, Programmable ROM | onsemi | W55F05 vs CAT25020VA-REV-C |
| CAT25020LE-1.8 | IC 256 X 8 SPI BUS SERIAL EEPROM, PDIP8, LEAD AND HALOGEN FREE, PLASTIC, DIP-8, Programmable ROM | onsemi | W55F05 vs CAT25020LE-1.8 |
| AT25020A-10PJ-1.8 | EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, MS-001BA, DIP-8 | Atmel Corporation | W55F05 vs AT25020A-10PJ-1.8 |
| W25X20AVDAIZ | Flash, 256KX8, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | Winbond Electronics Corp | W55F05 vs W25X20AVDAIZ |
| CAT25020PI-REV-B | EEPROM, 256X8, Serial, CMOS, PDIP8, PLASTIC, DIP-8 | Catalyst Semiconductor | W55F05 vs CAT25020PI-REV-B |