W55F05 vs CAT25020LE-1.8 feature comparison

W55F05 Winbond Electronics Corp

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CAT25020LE-1.8 onsemi

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP ON SEMICONDUCTOR
Part Package Code DIP DIP
Package Description DIP, DIP8(UNSPEC) DIP,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
Data Retention Time-Min 10
Endurance 10000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e3
Memory Density 524288 bit 2048 bit
Memory IC Type FLASH EEPROM
Memory Width 1 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 524288 words 256 words
Number of Words Code 512000 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 512KX1 256X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8(UNSPEC)
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 5 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.000004 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2.4 V 1.8 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Type NOR TYPE
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
Length 9.36 mm
Seated Height-Max 4.57 mm
Serial Bus Type SPI
Terminal Pitch 2.54 mm
Width 7.62 mm
Write Cycle Time-Max (tWC) 5 ms

Compare W55F05 with alternatives

Compare CAT25020LE-1.8 with alternatives