There are no models available for this part yet.
Overview of W3DG6435V75D2 by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for W3DG6435V75D2 by Microsemi Corporation
Part Data Attributes for W3DG6435V75D2 by Microsemi Corporation
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
MICROSEMI CORP
|
Part Package Code
|
DIMM
|
Package Description
|
DIMM,
|
Pin Count
|
168
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.36
|
Access Mode
|
FOUR BANK PAGE BURST
|
Additional Feature
|
AUTO/SELF REFRESH
|
JESD-30 Code
|
R-XDMA-N168
|
Memory Density
|
2147483648 bit
|
Memory IC Type
|
SYNCHRONOUS DRAM MODULE
|
Memory Width
|
64
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
168
|
Number of Words
|
33554432 words
|
Number of Words Code
|
32000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
32MX64
|
Package Body Material
|
UNSPECIFIED
|
Package Code
|
DIMM
|
Package Shape
|
RECTANGULAR
|
Package Style
|
MICROELECTRONIC ASSEMBLY
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
Self Refresh
|
YES
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
3 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
NO LEAD
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Alternate Parts for W3DG6435V75D2
This table gives cross-reference parts and alternative options found for W3DG6435V75D2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W3DG6435V75D2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
IBM11N32645CB-60J | EDO DRAM Module, 32MX64, 60ns, CMOS, DIMM-168 | IBM | W3DG6435V75D2 vs IBM11N32645CB-60J |
HYM72V32636AT8-H | Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 | SK Hynix Inc | W3DG6435V75D2 vs HYM72V32636AT8-H |
THMY6432G1EG-80 | IC 32M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168, DIMM-168, Dynamic RAM | Toshiba America Electronic Components | W3DG6435V75D2 vs THMY6432G1EG-80 |
EBS25UC8APFA-75 | Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 | Elpida Memory Inc | W3DG6435V75D2 vs EBS25UC8APFA-75 |
HYM72V653231LTH-10S | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | SK Hynix Inc | W3DG6435V75D2 vs HYM72V653231LTH-10S |
HYM71V32655ALT8M-S | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | SK Hynix Inc | W3DG6435V75D2 vs HYM71V32655ALT8M-S |
WED3DG6334V10D2 | Synchronous DRAM Module, 32MX64, CMOS, DIMM-168 | Microsemi Corporation | W3DG6435V75D2 vs WED3DG6334V10D2 |
MT16LSDT3264AG-10CXX | Synchronous DRAM Module, 32MX64, 6ns, CMOS, | Micron Technology Inc | W3DG6435V75D2 vs MT16LSDT3264AG-10CXX |
M366S3253DTS-C1L | Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 | Samsung Semiconductor | W3DG6435V75D2 vs M366S3253DTS-C1L |
MT8LSDT3264AG-133B1 | Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, MO-161, DIMM-168 | Micron Technology Inc | W3DG6435V75D2 vs MT8LSDT3264AG-133B1 |