Datasheets
THMY6432G1EG-80 by: Toshiba America Electronic Components

IC 32M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168, DIMM-168, Dynamic RAM

Part Details for THMY6432G1EG-80 by Toshiba America Electronic Components

Overview of THMY6432G1EG-80 by Toshiba America Electronic Components

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Applications Education and Research Consumer Electronics Computing and Data Storage

Part Details for THMY6432G1EG-80

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THMY6432G1EG-80 Part Data Attributes

THMY6432G1EG-80 Toshiba America Electronic Components
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THMY6432G1EG-80 Toshiba America Electronic Components IC 32M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168, DIMM-168, Dynamic RAM
Part Life Cycle Code Obsolete
Ihs Manufacturer TOSHIBA CORP
Part Package Code DIMM
Package Description DIMM, DIMM168
Pin Count 168
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST
Access Time-Max 6 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 125 MHz
I/O Type COMMON
JESD-30 Code R-XDMA-X168
Memory Density 2147483648 bit
Memory IC Type SYNCHRONOUS DRAM MODULE
Memory Width 64
Number of Functions 1
Number of Ports 1
Number of Terminals 168
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32MX64
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED
Package Code DIMM
Package Equivalence Code DIMM168
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified
Refresh Cycles 4096
Self Refresh YES
Standby Current-Max 0.016 A
Supply Current-Max 2.88 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form UNSPECIFIED
Terminal Pitch 1.27 mm
Terminal Position DUAL

Alternate Parts for THMY6432G1EG-80

This table gives cross-reference parts and alternative options found for THMY6432G1EG-80. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of THMY6432G1EG-80, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IBM11N32645CB-60J EDO DRAM Module, 32MX64, 60ns, CMOS, DIMM-168 IBM THMY6432G1EG-80 vs IBM11N32645CB-60J
HYM72V32636AT8-H Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 SK Hynix Inc THMY6432G1EG-80 vs HYM72V32636AT8-H
EBS25UC8APFA-75 Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 Elpida Memory Inc THMY6432G1EG-80 vs EBS25UC8APFA-75
HYM72V653231LTH-10S Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 SK Hynix Inc THMY6432G1EG-80 vs HYM72V653231LTH-10S
HYM71V32655ALT8M-S Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 SK Hynix Inc THMY6432G1EG-80 vs HYM71V32655ALT8M-S
WED3DG6334V10D2 Synchronous DRAM Module, 32MX64, CMOS, DIMM-168 Microsemi Corporation THMY6432G1EG-80 vs WED3DG6334V10D2
MT16LSDT3264AG-10CXX Synchronous DRAM Module, 32MX64, 6ns, CMOS, Micron Technology Inc THMY6432G1EG-80 vs MT16LSDT3264AG-10CXX
M366S3253DTS-C1L Synchronous DRAM Module, 32MX64, 6ns, CMOS, DIMM-168 Samsung Semiconductor THMY6432G1EG-80 vs M366S3253DTS-C1L
MT8LSDT3264AG-133B1 Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, MO-161, DIMM-168 Micron Technology Inc THMY6432G1EG-80 vs MT8LSDT3264AG-133B1
M366S3253CTS-C7A Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168 Samsung Semiconductor THMY6432G1EG-80 vs M366S3253CTS-C7A

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