Datasheets
W25Q64FVDAIG by:

Flash, 64MX1, PDIP8, DIP-8

Part Details for W25Q64FVDAIG by Winbond Electronics Corp

Overview of W25Q64FVDAIG by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for W25Q64FVDAIG

Part # Distributor Description Stock Price Buy
NexGen Digital   5998
RFQ

Part Details for W25Q64FVDAIG

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W25Q64FVDAIG Part Data Attributes:

W25Q64FVDAIG Winbond Electronics Corp
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W25Q64FVDAIG Winbond Electronics Corp Flash, 64MX1, PDIP8, DIP-8
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description DIP-8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Samacsys Manufacturer Winbond
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 104 MHz
Data Retention Time-Min 20
JESD-30 Code R-PDIP-T8
Length 9.27 mm
Memory Density 67108864 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 8
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial SERIAL
Programming Voltage 3 V
Qualification Status Not Qualified
Seated Height-Max 5.33 mm
Serial Bus Type SPI
Standby Current-Max 0.00005 A
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
Write Protection HARDWARE/SOFTWARE

Alternate Parts for W25Q64FVDAIG

This table gives cross-reference parts and alternative options found for W25Q64FVDAIG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q64FVDAIG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
W25Q64JVSFJQ Flash, Winbond Electronics Corp W25Q64FVDAIG vs W25Q64JVSFJQ
M25PX64STVME6TP EEPROM, 8MX8, Serial, CMOS, PDSO8, 8 X 6 MM, ROHS COMPLIANT, VDFPN-8 Numonyx Memory Solutions W25Q64FVDAIG vs M25PX64STVME6TP
W25Q64JVTBJQ Flash, Winbond Electronics Corp W25Q64FVDAIG vs W25Q64JVTBJQ
MX25L6406EMBI-12G Flash, 32MX2, PDSO8, 0.200 INCH, HALOGEN FREE AND ROHS COMPLIANT, VSOP-8 Macronix International Co Ltd W25Q64FVDAIG vs MX25L6406EMBI-12G
M25PX64STVME6TG EEPROM, 8MX8, Serial, CMOS, PDSO8, 8 X 6 MM, ROHS COMPLIANT, VDFPN-8 Numonyx Memory Solutions W25Q64FVDAIG vs M25PX64STVME6TG
W25Q64FVZEIG Flash, 64MX1, PDSO8, WSON-8 Winbond Electronics Corp W25Q64FVDAIG vs W25Q64FVZEIG
M25PX64STVMF6P EEPROM, 8MX8, Serial, CMOS, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 Numonyx Memory Solutions W25Q64FVDAIG vs M25PX64STVMF6P
W25Q64JVSSJQTR Flash, Winbond Electronics Corp W25Q64FVDAIG vs W25Q64JVSSJQTR
S25FL164K0XMFB010 Flash, Cypress Semiconductor W25Q64FVDAIG vs S25FL164K0XMFB010
M25PX64STVMF6G EEPROM, 8MX8, Serial, CMOS, PDSO16, 0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP-16 Numonyx Memory Solutions W25Q64FVDAIG vs M25PX64STVMF6G

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