W25Q64FVDAIG vs W25Q64JVTBJQ feature comparison

W25Q64FVDAIG Winbond Electronics Corp

Buy Now Datasheet

W25Q64JVTBJQ Winbond Electronics Corp

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description DIP-8 TBGA,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Samacsys Manufacturer Winbond
Alternate Memory Width 1 1
Clock Frequency-Max (fCLK) 104 MHz 133 MHz
Data Retention Time-Min 20 20
JESD-30 Code R-PDIP-T8 R-PBGA-B24
Length 9.27 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 24
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TBGA
Package Equivalence Code DIP8,.3 BGA24,5X5,40
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE GRID ARRAY, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 5.33 mm 1.2 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.00005 A 0.00005 A
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE BALL
Terminal Pitch 2.54 mm 1 mm
Terminal Position DUAL BOTTOM
Width 7.62 mm 6 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 2
Date Of Intro 2018-04-03
Additional Feature IT ALSO OPERATES AT 2.7V @ 104MHZ
Endurance 100000 Write/Erase Cycles
Supply Current-Max 0.025 mA
Type NOR TYPE

Compare W25Q64FVDAIG with alternatives

Compare W25Q64JVTBJQ with alternatives