Datasheets
UPD27C256AD-20 by:

UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28

Part Details for UPD27C256AD-20 by NEC Electronics Group

Overview of UPD27C256AD-20 by NEC Electronics Group

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Applications Consumer Electronics

Part Details for UPD27C256AD-20

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UPD27C256AD-20 Part Data Attributes

UPD27C256AD-20 NEC Electronics Group
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UPD27C256AD-20 NEC Electronics Group UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NEC ELECTRONICS CORP
Part Package Code DIP
Package Description WDIP,
Pin Count 28
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for UPD27C256AD-20

This table gives cross-reference parts and alternative options found for UPD27C256AD-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UPD27C256AD-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27256-20DEB UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 AMD UPD27C256AD-20 vs AM27256-20DEB
NMC27C256BQ20 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation UPD27C256AD-20 vs NMC27C256BQ20
27C256-20/J 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc UPD27C256AD-20 vs 27C256-20/J
AM27C256-200/BXA UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD UPD27C256AD-20 vs AM27C256-200/BXA
NM27C256Q200 IC 32K X 8 UVPROM, 200 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM Texas Instruments UPD27C256AD-20 vs NM27C256Q200
AM27C256-200DC UVPROM, 32KX8, 200ns, CMOS, CDIP28, DIP-28 Spansion UPD27C256AD-20 vs AM27C256-200DC
CY27C256A-200WMB UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Rochester Electronics LLC UPD27C256AD-20 vs CY27C256A-200WMB
TMS27C256-20JE 262 144-Bitprogrammable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments UPD27C256AD-20 vs TMS27C256-20JE
QD27C256-200V10 UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Intel Corporation UPD27C256AD-20 vs QD27C256-200V10
AM27C256-205DCB UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD UPD27C256AD-20 vs AM27C256-205DCB
Part Number Description Manufacturer Compare
27C256/BXA-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28 YAGEO Corporation UPD27C256AD-20 vs 27C256/BXA-20
M38510/22402BYA UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28 Intel Corporation UPD27C256AD-20 vs M38510/22402BYA
TMS27PC256-20NE 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments UPD27C256AD-20 vs TMS27PC256-20NE
M27256-20F6 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics UPD27C256AD-20 vs M27256-20F6
QP27C256-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v UPD27C256AD-20 vs QP27C256-200/XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD UPD27C256AD-20 vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation UPD27C256AD-20 vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 VLSI Technology Inc UPD27C256AD-20 vs 5962-8606301XX
5662-860631YA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v UPD27C256AD-20 vs 5662-860631YA
MBM27C256A-20WZ 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 FUJITSU Limited UPD27C256AD-20 vs MBM27C256A-20WZ

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