Memory
M38510/22402BYA
Description: UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28

Overview of M38510/22402BYA by Intel Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
M38510/12907BPA Rochester Electronics LLC And Gate Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CDIP8, CERAMIC, DIP-8
54LS242/BCA Rochester Electronics LLC 54LS242/BCA (DM: M38510/32801BCA)
5438/BCA Rochester Electronics 5438/BCA (DM: M38510/00303BCA)

CAD Models for M38510/22402BYA by Intel Corporation
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Part Data Attributes for M38510/22402BYA by Intel Corporation

M38510/22402BYA
Intel Corporation
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTEL CORP
Part Package Code
DIP
Package Description
DIP,
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.61
Access Time-Max
200 ns
JESD-30 Code
R-XDIP-T28
JESD-609 Code
e0
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
Package Body Material
UNSPECIFIED
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-M-38510 Class B
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
MOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Want to compare parts?
  1. M38510/22402BYA
    Intel Corporation
    UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28
    VS

Alternate Parts for M38510/22402BYA

This table gives cross-reference parts and alternative options found for M38510/22402BYA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/22402BYA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
27C256MQ7B/Y20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v M38510/22402BYA vs 27C256MQ7B/Y20
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor M38510/22402BYA vs 5962-8606301XX
AS27C256A-20JI/MIL Memory IC Micross Components M38510/22402BYA vs AS27C256A-20JI/MIL
NMC27C256BNE200 IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM Texas Instruments M38510/22402BYA vs NMC27C256BNE200
TMS27PC256-20NE 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments M38510/22402BYA vs TMS27PC256-20NE
QP27256-2 OTP ROM, 32KX8, 200ns, NMOS, PDIP28, PLASTIC, DIP-28 Intel Corporation M38510/22402BYA vs QP27256-2
NM27LC256NE200 32KX8 OTPROM, 200ns, PDIP28, PLASTIC, DIP-28 Texas Instruments M38510/22402BYA vs NM27LC256NE200
CY27C256-200WC UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Rochester Electronics LLC M38510/22402BYA vs CY27C256-200WC
NM27C256N200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation M38510/22402BYA vs NM27C256N200
27C256MQB/C20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Thales Group M38510/22402BYA vs 27C256MQB/C20
Part Number Description Manufacturer Compare
27C256/BXA-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28 YAGEO Corporation M38510/22402BYA vs 27C256/BXA-20
TMS27PC256-20NE 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments M38510/22402BYA vs TMS27PC256-20NE
M27256-20F6 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics M38510/22402BYA vs M27256-20F6
QP27C256-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v M38510/22402BYA vs QP27C256-200/XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD M38510/22402BYA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation M38510/22402BYA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 VLSI Technology Inc M38510/22402BYA vs 5962-8606301XX
5662-860631YA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v M38510/22402BYA vs 5662-860631YA
MBM27C256A-20WZ 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 FUJITSU Limited M38510/22402BYA vs MBM27C256A-20WZ
FT27C256R-20MMB UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Force Technologies Ltd M38510/22402BYA vs FT27C256R-20MMB

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