There are no models available for this part yet.
Overview of TSPC750AMGB/Q10LE by Thales Group
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for TSPC750AMGB/Q10LE by Thales Group
Part Data Attributes for TSPC750AMGB/Q10LE by Thales Group
|
|
---|---|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
THOMSON-CSF SEMICONDUCTORS
|
Part Package Code
|
BGA
|
Package Description
|
,
|
Pin Count
|
360
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.A.2
|
HTS Code
|
8542.31.00.01
|
Address Bus Width
|
32
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
Clock Frequency-Max
|
83.3 MHz
|
External Data Bus Width
|
64
|
Format
|
FLOATING POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-CBGA-B360
|
Low Power Mode
|
YES
|
Number of Terminals
|
360
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-55 °C
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code
|
BGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY
|
Qualification Status
|
Not Qualified
|
Screening Level
|
MIL-STD-883 Class B
|
Speed
|
233 MHz
|
Supply Voltage-Max
|
2.7 V
|
Supply Voltage-Min
|
2.5 V
|
Supply Voltage-Nom
|
2.6 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
MILITARY
|
Terminal Form
|
BALL
|
Terminal Position
|
BOTTOM
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Alternate Parts for TSPC750AMGB/Q10LE
This table gives cross-reference parts and alternative options found for TSPC750AMGB/Q10LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AMGB/Q10LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
TSPC750AMGU10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSPC750AMGB/Q10LE vs TSPC750AMGU10LE |
TSPC750AMGU10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGB/Q10LE vs TSPC750AMGU10LH |
TSPC750AVG10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGB/Q10LE vs TSPC750AVG10LH |
TSXPC750AMGB/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSPC750AMGB/Q10LE vs TSXPC750AMGB/T10LE |
TSPC750AVG10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGB/Q10LE vs TSPC750AVG10LE |
TSPC750AVGB/Q10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGB/Q10LE vs TSPC750AVGB/Q10LE |
TSPC750AVGB/T10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGB/Q10LE vs TSPC750AVGB/T10LE |
TSPC750AMG10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGB/Q10LE vs TSPC750AMG10LH |
TSXPC750AVG10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Teledyne e2v | TSPC750AMGB/Q10LE vs TSXPC750AVG10LE |
TSPC750AMG10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 | Thales Group | TSPC750AMGB/Q10LE vs TSPC750AMG10LE |