Microcontrollers and Processors
TSPC750AMGB/Q10LE
Description: RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360

Overview of TSPC750AMGB/Q10LE by Thales Group

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Part Data Attributes for TSPC750AMGB/Q10LE by Thales Group

TSPC750AMGB/Q10LE
Thales Group
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
Part Package Code
BGA
Package Description
,
Pin Count
360
Reach Compliance Code
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
83.3 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-CBGA-B360
Low Power Mode
YES
Number of Terminals
360
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B
Speed
233 MHz
Supply Voltage-Max
2.7 V
Supply Voltage-Min
2.5 V
Supply Voltage-Nom
2.6 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
BALL
Terminal Position
BOTTOM
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
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  1. TSPC750AMGB/Q10LE
    Thales Group
    RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360
    VS

Alternate Parts for TSPC750AMGB/Q10LE

This table gives cross-reference parts and alternative options found for TSPC750AMGB/Q10LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC750AMGB/Q10LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
TSPC750AMGU10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v TSPC750AMGB/Q10LE vs TSPC750AMGU10LE
TSPC750AMGU10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AMGU10LH
TSPC750AVG10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AVG10LH
TSXPC750AMGB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v TSPC750AMGB/Q10LE vs TSXPC750AMGB/T10LE
TSPC750AVG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AVG10LE
TSPC750AVGB/Q10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AVGB/Q10LE
TSPC750AVGB/T10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AVGB/T10LE
TSPC750AMG10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AMG10LH
TSXPC750AVG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v TSPC750AMGB/Q10LE vs TSXPC750AVG10LE
TSPC750AMG10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AMG10LE
Part Number Description Manufacturer Compare
TSXPC750AMGSU10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGB/Q10LE vs TSXPC750AMGSU10LH
TSXC750AVGSB/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AMGB/Q10LE vs TSXC750AVGSB/T12LH
TSPC750AMGSB/Q10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AMGSB/Q10LH
TSXC750AMGSU/T12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AMGB/Q10LE vs TSXC750AMGSU/T12LH
TSPC750AMGS10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 Thales Group TSPC750AMGB/Q10LE vs TSPC750AMGS10LH
TSPC750AMGSB/T8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSPC750AMGB/Q10LE vs TSPC750AMGSB/T8LE
TSPC750AVGS12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Teledyne e2v TSPC750AMGB/Q10LE vs TSPC750AVGS12LE
TSXPC750AVGSB/Q8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGB/Q10LE vs TSXPC750AVGSB/Q8LH
TSXPC750AMGB/Q10LE RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, BGA-360 Teledyne e2v TSPC750AMGB/Q10LE vs TSXPC750AMGB/Q10LE
TSXPC750AMGSU/T8LH RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation TSPC750AMGB/Q10LE vs TSXPC750AMGSU/T8LH

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