Part Details for TSXPC750AMGSU10LH by Atmel Corporation
Overview of TSXPC750AMGSU10LH by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Part Details for TSXPC750AMGSU10LH
TSXPC750AMGSU10LH CAD Models
TSXPC750AMGSU10LH Part Data Attributes
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TSXPC750AMGSU10LH
Atmel Corporation
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Datasheet
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TSXPC750AMGSU10LH
Atmel Corporation
RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | CGA | |
| Package Description | CGA, | |
| Pin Count | 360 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 83.3 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-C360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | CGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.2 mm | |
| Speed | 233 MHz | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.5 V | |
| Supply Voltage-Nom | 2.6 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | C BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC750AMGSU10LH
This table gives cross-reference parts and alternative options found for TSXPC750AMGSU10LH. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC750AMGSU10LH, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC750AVGS10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSXPC750AMGSU10LH vs TSPC750AVGS10LE |
| TSXPC750AVGSU10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXPC750AMGSU10LH vs TSXPC750AVGSU10LE |
| TSPC750AVGSB/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSXPC750AMGSU10LH vs TSPC750AVGSB/T10LH |
| TSPC750AMGSU10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CGA-360 | Thales Group | TSXPC750AMGSU10LH vs TSPC750AMGSU10LE |
| TSPC750AVGSB/Q10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, CERAMIC, CGA-360 | Atmel Corporation | TSXPC750AMGSU10LH vs TSPC750AVGSB/Q10LH |
| TSXPC750AMGS10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | TSXPC750AMGSU10LH vs TSXPC750AMGS10LE |
| TSXPC750AMGSB/T10LH | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Atmel Corporation | TSXPC750AMGSU10LH vs TSXPC750AMGSB/T10LH |
| TSXPC750AMGSB/Q10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | TSXPC750AMGSU10LH vs TSXPC750AMGSB/Q10LE |
| TSPC750AMGSB/Q10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | TSXPC750AMGSU10LH vs TSPC750AMGSB/Q10LE |
| TSXPC750AMGSU10LE | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 | Teledyne e2v | TSXPC750AMGSU10LH vs TSXPC750AMGSU10LE |