Part Details for TSPC603RMG10LC by Atmel Corporation
Overview of TSPC603RMG10LC by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC603RMG10LC
TSPC603RMG10LC CAD Models
TSPC603RMG10LC Part Data Attributes:
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TSPC603RMG10LC
Atmel Corporation
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TSPC603RMG10LC
Atmel Corporation
RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA255,16X16,50 | |
| Pin Count | 255 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 75 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B255 | |
| JESD-609 Code | e0 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA255,16X16,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3 mm | |
| Speed | 233 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC603RMG10LC
This table gives cross-reference parts and alternative options found for TSPC603RMG10LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC603RMG10LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC603RMGU/T10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMG10LC vs TSPC603RMGU/T10LC |
| TSPC603RMGB/T10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSPC603RMG10LC vs TSPC603RMGB/T10LC |
| TSPC603RVG10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSPC603RMG10LC vs TSPC603RVG10LC |
| TSXPC603RMGB/T10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMG10LC vs TSXPC603RMGB/T10LC |
| TSPC603RVGH10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMG10LC vs TSPC603RVGH10LC |
| TSPC603RMGH10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255 | e2v technologies | TSPC603RMG10LC vs TSPC603RMGH10LC |
| TSXPC603RMGU/T10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | TSPC603RMG10LC vs TSXPC603RMGU/T10LC |
| TSPC603RMG10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSPC603RMG10LC vs TSPC603RMG10LC |
| TSXPC603RVGH10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | e2v technologies | TSPC603RMG10LC vs TSXPC603RVGH10LC |
| TSPC603RVGB/Q10LC | RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | e2v technologies | TSPC603RMG10LC vs TSPC603RVGB/Q10LC |