Memory
TC55VCM316BSGN55
Toshiba America Electronic Components
Description: IC 512K X 16 STANDARD SRAM, 70 ns, PDSO48, 12 X 14 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48, Static RAM

Overview of TC55VCM316BSGN55 by Toshiba America Electronic Components

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 0 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 10 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Industrial Automation Computing and Data Storage

CAD Models for TC55VCM316BSGN55 by Toshiba America Electronic Components
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Part Data Attributes for TC55VCM316BSGN55 by Toshiba America Electronic Components

TC55VCM316BSGN55
Toshiba America Electronic Components
-
-
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Ihs Manufacturer
TOSHIBA CORP
Part Package Code
TSOP1
Package Description
12 X 14 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Pin Count
48
Reach Compliance Code
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
70 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G48
Length
12.4 mm
Memory Density
8388608 bit
Memory IC Type
STANDARD SRAM
Memory Width
16
Number of Functions
1
Number of Terminals
48
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TSOP1
Package Equivalence Code
TSSOP48,.55,20
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Standby Voltage-Min
1.5 V
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
12 mm
Want to compare parts?
  1. TC55VCM316BSGN55
    Toshiba America Electronic Components
    IC 512K X 16 STANDARD SRAM, 70 ns, PDSO48, 12 X 14 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48, Static RAM
    VS

Alternate Parts for TC55VCM316BSGN55

This table gives cross-reference parts and alternative options found for TC55VCM316BSGN55. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TC55VCM316BSGN55, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
K6T8016C3M-RF55 Standard SRAM, 512KX16, 55ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44 Samsung Semiconductor TC55VCM316BSGN55 vs K6T8016C3M-RF55
CY62157DV30L-45ZSXI Standard SRAM, 512KX16, 45ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 Cypress Semiconductor TC55VCM316BSGN55 vs CY62157DV30L-45ZSXI
TC55VBM316ATGN55 IC 512K X 16 STANDARD SRAM, 70 ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48, Static RAM Toshiba America Electronic Components TC55VCM316BSGN55 vs TC55VBM316ATGN55
R1LV0816ASB-5SI 512KX16 STANDARD SRAM, 70ns, PDSO44, 11.76 X 18.41 MM, PLASTIC, TSOP2-44 Renesas Electronics Corporation TC55VCM316BSGN55 vs R1LV0816ASB-5SI
K6T8016C3M-RB70 Standard SRAM, 512KX16, 70ns, CMOS, PDSO44, 0.400 INCH, REVERSE, TSOP2-44 Samsung Semiconductor TC55VCM316BSGN55 vs K6T8016C3M-RB70
CY62157EV30LL-45ZXAT Standard SRAM, 512KX16, 45ns, CMOS, PDSO48, TSOP1-48 Infineon Technologies AG TC55VCM316BSGN55 vs CY62157EV30LL-45ZXAT
BH616UV8011TIG55 Standard SRAM, 512KX16, 55ns, CMOS, PDSO48, 12 X 20 MM, GREEN, TSOP1-48 Brilliance Semiconductor Inc TC55VCM316BSGN55 vs BH616UV8011TIG55
IS62C51216AL-55TLI Standard SRAM, 512KX16, 55ns, CMOS, PDSO44, 0.400 INCH, LEAD FREE, TSOP2-44 Integrated Silicon Solution Inc TC55VCM316BSGN55 vs IS62C51216AL-55TLI
AS6UA51216-70TC Standard SRAM, 512KX16, 70ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 Alliance Semiconductor Corporation TC55VCM316BSGN55 vs AS6UA51216-70TC
K6X8016C3B-TB550 Standard SRAM, 512KX16, 55ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 Samsung Semiconductor TC55VCM316BSGN55 vs K6X8016C3B-TB550

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