Part Details for SM32DM355GCEM216EP by Texas Instruments
Overview of SM32DM355GCEM216EP by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for SM32DM355GCEM216EP
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
296-24947-ND
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DigiKey | IC DSP FIXED-POINT 337NFBGA Min Qty: 160 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
|
$43.8705 | Buy Now |
|
DISTI #
595-32DM355GCEM216EP
|
Mouser Electronics | Processors - Application Specialized Dig Media SOC RoHS: Not Compliant | 0 |
|
$43.7500 | Order Now |
|
|
Ameya Holding Limited | IC DSP FIXED-POINT 337NFBGA | 3268 |
|
RFQ |
Part Details for SM32DM355GCEM216EP
SM32DM355GCEM216EP CAD Models
SM32DM355GCEM216EP Part Data Attributes:
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SM32DM355GCEM216EP
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
SM32DM355GCEM216EP
Texas Instruments
Enhanced Product Digital Media DM355 Processor 337-NFBGA -55 to 125
|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA337,19X19,25 | |
| Pin Count | 337 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Texas Instruments | |
| Bit Size | 32 | |
| Bus Compatibility | I2C; SPI; UART; USB | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| JESD-30 Code | S-PBGA-B337 | |
| JESD-609 Code | e0 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 337 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA337,19X19,25 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (words) | 8192 | |
| Seated Height-Max | 1.3 mm | |
| Supply Voltage-Max | 1.365 V | |
| Supply Voltage-Min | 1.235 V | |
| Supply Voltage-Nom | 1.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | Digital Media SoC |
Alternate Parts for SM32DM355GCEM216EP
This table gives cross-reference parts and alternative options found for SM32DM355GCEM216EP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of SM32DM355GCEM216EP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| V62/09643-01XE | Enhanced Product Digital Media DM355 Processor 337-NFBGA -55 to 125 | Texas Instruments | SM32DM355GCEM216EP vs V62/09643-01XE |