SM32DM355GCEM216EP
vs
V62/09643-01XE
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Lifetime Buy
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA, BGA337,19X19,25
|
LFBGA, BGA337,19X19,25
|
| Pin Count |
337
|
337
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Bit Size |
32
|
32
|
| Bus Compatibility |
I2C; SPI; UART; USB
|
I2C; SPI; UART; USB
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| JESD-30 Code |
S-PBGA-B337
|
S-PBGA-B337
|
| JESD-609 Code |
e0
|
e0
|
| Length |
13 mm
|
13 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
337
|
337
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA337,19X19,25
|
BGA337,19X19,25
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| RAM (words) |
8192
|
8192
|
| Seated Height-Max |
1.3 mm
|
1.3 mm
|
| Supply Voltage-Max |
1.365 V
|
1.365 V
|
| Supply Voltage-Min |
1.235 V
|
1.235 V
|
| Supply Voltage-Nom |
1.3 V
|
1.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13 mm
|
13 mm
|
| uPs/uCs/Peripheral ICs Type |
Digital Media SoC
|
Digital Media SoC
|
| Base Number Matches |
1
|
1
|
|
|
|