Part Details for S70FL256P0XBHI200 by Spansion
Overview of S70FL256P0XBHI200 by Spansion
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for S70FL256P0XBHI200
S70FL256P0XBHI200 CAD Models
S70FL256P0XBHI200 Part Data Attributes:
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S70FL256P0XBHI200
Spansion
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Datasheet
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S70FL256P0XBHI200
Spansion
Flash, 256MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, LEAD FREE, BGA-24
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | SPANSION INC | |
| Part Package Code | BGA | |
| Package Description | TBGA, BGA24,5X5,40 | |
| Pin Count | 24 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.1.A | |
| HTS Code | 8542.32.00.71 | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.00002 A | |
| Supply Current-Max | 0.044 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for S70FL256P0XBHI200
This table gives cross-reference parts and alternative options found for S70FL256P0XBHI200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S70FL256P0XBHI200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| S70FL256P0XBHI200 | Flash, 256MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, LOW HALOGEN AND LEAD FREE, BGA-24 | Cypress Semiconductor | S70FL256P0XBHI200 vs S70FL256P0XBHI200 |
| S70FL256P0XBHI203 | Flash, 256MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, LEAD FREE, BGA-24 | Spansion | S70FL256P0XBHI200 vs S70FL256P0XBHI203 |
| S70FL256P0XBHI203 | Flash, 256MX1, PBGA24, 6 X 8 MM, 1 MM PITCH, LOW HALOGEN AND LEAD FREE, BGA-24 | Cypress Semiconductor | S70FL256P0XBHI200 vs S70FL256P0XBHI203 |