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S70FL256P0XBHI200
Spansion
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Check for Price | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 20 µA | 44 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | BGA | TBGA, BGA24,5X5,40 | 24 | unknown | 3A991.B.1.A | 8542.32.00.71 | ||
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S70FL256P0XBHI200
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 268.4355 Mbit | 8 | 32MX8 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | QSPI | 20 µA | 44 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | 6 X 8 MM, 1 MM PITCH, LOW HALOGEN AND LEAD FREE, BGA-24 | compliant | EAR99 | 8542.32.00.51 |