Datasheets
S63364I-P by: Gould Ami

MASK ROM, 8KX8, 150ns, CMOS, PDIP24

Part Details for S63364I-P by Gould Ami

Overview of S63364I-P by Gould Ami

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for S63364I-P

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S63364I-P Part Data Attributes

S63364I-P Gould Ami
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S63364I-P Gould Ami MASK ROM, 8KX8, 150ns, CMOS, PDIP24
Part Life Cycle Code Obsolete
Ihs Manufacturer GOULD AMI
Package Description ,
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 450 ns
JESD-30 Code R-PDIP-T24
Memory Density 16384 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2KX8
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Current-Max 0.1 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for S63364I-P

This table gives cross-reference parts and alternative options found for S63364I-P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of S63364I-P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AT27HC642R-70DM UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Atmel Corporation S63364I-P vs AT27HC642R-70DM
5962-8751503JA 8KX8 UVPROM, 70ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 STMicroelectronics S63364I-P vs 5962-8751503JA
27HC641L-55/J 8K X 8 UVPROM, 55 ns, CDIP24, WINDOWED, CERDIP-24 Microchip Technology Inc S63364I-P vs 27HC641L-55/J
WS57C49B-55T UVPROM, 8KX8, 55ns, CMOS, CDIP24, Waferscale Integration Inc S63364I-P vs WS57C49B-55T
M27HC641-35XFS1 8KX8 UVPROM, 35ns, CDIP24, 0.300 INCH, FRIT SEALED, WINDOWED, CERAMIC, DIP-24 STMicroelectronics S63364I-P vs M27HC641-35XFS1
27HC641-70/J 8K X 8 UVPROM, 70 ns, CDIP24, WINDOWED, CERDIP-24 Microchip Technology Inc S63364I-P vs 27HC641-70/J
AT27HC641R-70DM UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Atmel Corporation S63364I-P vs AT27HC641R-70DM
F356435S MASK ROM, 8KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation S63364I-P vs F356435S
HI1264B-D-000 MASK ROM, 8KX8, 35ns, CMOS, CDIP24 Hughes Aircraft S63364I-P vs HI1264B-D-000
AT27HC641R-45LC UVPROM, 8KX8, 45ns, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 Atmel Corporation S63364I-P vs AT27HC641R-45LC

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