There are no models available for this part yet.
Overview of MM74C89N by Fairchild Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Space Technology
Computing and Data Storage
Aerospace and Defense
Automotive
CAD Models for MM74C89N by Fairchild Semiconductor Corporation
Part Data Attributes for MM74C89N by Fairchild Semiconductor Corporation
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code
|
DIP
|
Package Description
|
0.300 INCH, PLASTIC, MS-001, DIP-16
|
Pin Count
|
16
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A001.A.2.C
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
650 ns
|
JESD-30 Code
|
R-PDIP-T16
|
JESD-609 Code
|
e0
|
Length
|
19.305 mm
|
Memory Density
|
64 bit
|
Memory IC Type
|
STANDARD SRAM
|
Memory Width
|
4
|
Number of Functions
|
1
|
Number of Terminals
|
16
|
Number of Words
|
16 words
|
Number of Words Code
|
16
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
125 °C
|
Operating Temperature-Min
|
-55 °C
|
Organization
|
16X4
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP16,.3
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
5.08 mm
|
Supply Current-Max
|
0.0003 mA
|
Supply Voltage-Max (Vsup)
|
15 V
|
Supply Voltage-Min (Vsup)
|
3 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
MILITARY
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Width
|
7.62 mm
|
Alternate Parts for MM74C89N
This table gives cross-reference parts and alternative options found for MM74C89N. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MM74C89N, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
AM27S02PCB | Standard SRAM, 16X4, 35ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | MM74C89N vs AM27S02PCB |
N7489B | Standard SRAM, 16X4, TTL, PDIP16 | Signetics | MM74C89N vs N7489B |
AM27LS06PC | Standard SRAM, 16X4, 55ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | MM74C89N vs AM27LS06PC |
AM27LS03-55DCB | Standard SRAM, 16X4, 55ns, Bipolar, CDIP16, DIP-16 | AMD | MM74C89N vs AM27LS03-55DCB |
S82S25F | Standard SRAM, 16X4, 60ns, TTL, CDIP16 | Signetics | MM74C89N vs S82S25F |
AM27S02APCB | Standard SRAM, 16X4, 25ns, TTL, PDIP16, PLASTIC, DIP-16 | AMD | MM74C89N vs AM27S02APCB |
AM27LS02-55DCB | Standard SRAM, 16X4, 55ns, Bipolar, CDIP16, DIP-16 | AMD | MM74C89N vs AM27LS02-55DCB |
AM27S03DC | Standard SRAM, 16X4, 35ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | MM74C89N vs AM27S03DC |
AM27LS02DC | Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | AMD | MM74C89N vs AM27LS02DC |
AM27LS03-30/BEA | Standard SRAM | Rochester Electronics LLC | MM74C89N vs AM27LS03-30/BEA |