M38510/22402BYA by:

UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28

Part Details for M38510/22402BYA by Intel Corporation

Overview of M38510/22402BYA by Intel Corporation

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
M38510/12907BPA Rochester Electronics LLC And Gate Based Peripheral Driver, 2 Driver, 0.5A, BIPolar, CDIP8, CERAMIC, DIP-8
54LS242/BCA Rochester Electronics LLC 54LS242/BCA (DM: M38510/32801BCA)
5438/BCA Rochester Electronics 5438/BCA (DM: M38510/00303BCA)

Part Details for M38510/22402BYA

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M38510/22402BYA Part Data Attributes

M38510/22402BYA Intel Corporation
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M38510/22402BYA Intel Corporation UVPROM, 32KX8, 200ns, MOS, 0.5 X 0.625 INCH, DIP-28
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 200 ns
JESD-30 Code R-XDIP-T28
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 32KX8
Package Body Material UNSPECIFIED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-M-38510 Class B
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology MOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for M38510/22402BYA

This table gives cross-reference parts and alternative options found for M38510/22402BYA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M38510/22402BYA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
27C256MQ7B/Y20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v M38510/22402BYA vs 27C256MQ7B/Y20
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 QP Semiconductor M38510/22402BYA vs 5962-8606301XX
AS27C256A-20JI/MIL Memory IC Micross Components M38510/22402BYA vs AS27C256A-20JI/MIL
NMC27C256BNE200 IC 32K X 8 OTPROM, 200 ns, PDIP28, PLASTIC, DIP-28, Programmable ROM Texas Instruments M38510/22402BYA vs NMC27C256BNE200
TMS27PC256-20NE 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments M38510/22402BYA vs TMS27PC256-20NE
QP27256-2 OTP ROM, 32KX8, 200ns, NMOS, PDIP28, PLASTIC, DIP-28 Intel Corporation M38510/22402BYA vs QP27256-2
NM27LC256NE200 32KX8 OTPROM, 200ns, PDIP28, PLASTIC, DIP-28 Texas Instruments M38510/22402BYA vs NM27LC256NE200
CY27C256-200WC UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Rochester Electronics LLC M38510/22402BYA vs CY27C256-200WC
NM27C256N200 OTP ROM, 32KX8, 200ns, CMOS, PDIP28, PLASTIC, DIP-28 Fairchild Semiconductor Corporation M38510/22402BYA vs NM27C256N200
27C256MQB/C20 UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Thales Group M38510/22402BYA vs 27C256MQB/C20
Part Number Description Manufacturer Compare
27C256/BXA-20 UVPROM, 32KX8, 200ns, CMOS, CDIP28 YAGEO Corporation M38510/22402BYA vs 27C256/BXA-20
TMS27PC256-20NE 32KX8 OTPROM, 200ns, PDIP28 Texas Instruments M38510/22402BYA vs TMS27PC256-20NE
M27256-20F6 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics M38510/22402BYA vs M27256-20F6
QP27C256-200/XA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v M38510/22402BYA vs QP27C256-200/XA
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD M38510/22402BYA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 Intel Corporation M38510/22402BYA vs 5962-8606301XX
5962-8606301XX UVPROM, 32KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28 VLSI Technology Inc M38510/22402BYA vs 5962-8606301XX
5662-860631YA UVPROM, 32KX8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Teledyne e2v M38510/22402BYA vs 5662-860631YA
MBM27C256A-20WZ 32KX8 UVPROM, 200ns, CDIP28, CERDIP-28 FUJITSU Limited M38510/22402BYA vs MBM27C256A-20WZ
FT27C256R-20MMB UVPROM, 32KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Force Technologies Ltd M38510/22402BYA vs FT27C256R-20MMB

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