Part Details for M2764AF1 by STMicroelectronics
Overview of M2764AF1 by STMicroelectronics
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Price & Stock for M2764AF1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 200 |
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RFQ | ||
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DISTI #
40248
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Jameco Electronics | IC 2764A-25 EPROM 64K-Bit 250ns CMOS Express ROM Device Min Qty: 1 Container: Each | 182 |
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$3.9500 / $4.9500 | Buy Now |
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Quest Components | EPROM, 8K x 8, 28 Pin, Ceramic, DIP | 1 |
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$8.0400 / $12.0600 | Buy Now |
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Quest Components | EPROM, 8K x 8, 28 Pin, Ceramic, DIP | 4 |
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$8.8440 / $12.0600 | Buy Now |
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Quest Components | EPROM, 8K x 8, 28 Pin, Ceramic, DIP | 53 |
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$7.3710 / $10.9200 | Buy Now |
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Quest Components | EPROM, 8K x 8, 28 Pin, Ceramic, DIP | 29 |
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$8.0400 / $12.0600 | Buy Now |
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Chip1Cloud | 2000 |
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RFQ |
Part Details for M2764AF1
M2764AF1 CAD Models
M2764AF1 Part Data Attributes
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M2764AF1
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
M2764AF1
STMicroelectronics
8KX8 UVPROM, 250ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Access Time-Max | 250 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.71 mm | |
| Supply Current-Max | 0.075 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M2764AF1
This table gives cross-reference parts and alternative options found for M2764AF1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2764AF1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 27C64MQ25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | e2v technologies | M2764AF1 vs 27C64MQ25 |
| 27C64A/BXA-25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28 | YAGEO Corporation | M2764AF1 vs 27C64A/BXA-25 |
| AM27C64-255DC | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M2764AF1 vs AM27C64-255DC |
| 27C64MQ7B/Y25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | M2764AF1 vs 27C64MQ7B/Y25 |
| TMS27C64-25JE | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M2764AF1 vs TMS27C64-25JE |
| AM27C64-250DCB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M2764AF1 vs AM27C64-250DCB |
| 27C64MQG/B25 | UVPROM, 8KX8, 250ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | M2764AF1 vs 27C64MQG/B25 |
| TMS27C64-25JE4 | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M2764AF1 vs TMS27C64-25JE4 |
| AM27C64-255DIB | UVPROM, 8KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M2764AF1 vs AM27C64-255DIB |
| TMS2764A-25JP4 | 8KX8 UVPROM, 250ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M2764AF1 vs TMS2764A-25JP4 |