Part Details for K8D6316UBM-PI07 by Samsung Semiconductor
Overview of K8D6316UBM-PI07 by Samsung Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for K8D6316UBM-PI07
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | NOR Flash, 4M x 16, 48 Pin, Plastic, TSSOP | 1 |
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$6.0000 / $9.0000 | Buy Now |
Part Details for K8D6316UBM-PI07
K8D6316UBM-PI07 CAD Models
K8D6316UBM-PI07 Part Data Attributes
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K8D6316UBM-PI07
Samsung Semiconductor
Buy Now
Datasheet
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Compare Parts:
K8D6316UBM-PI07
Samsung Semiconductor
Flash, 4MX16, 70ns, PDSO48
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 70 ns | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PDSO-G48 | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Sectors/Size | 8,127 | |
| Number of Terminals | 48 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP48,.8,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Sector Size | 8K,64K | |
| Standby Current-Max | 0.00003 A | |
| Supply Current-Max | 0.05 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Toggle Bit | YES | |
| Type | NOR TYPE |
Alternate Parts for K8D6316UBM-PI07
This table gives cross-reference parts and alternative options found for K8D6316UBM-PI07. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K8D6316UBM-PI07, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY27C256A-70JC | OTP ROM, 32KX8, 70ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | K8D6316UBM-PI07 vs CY27C256A-70JC |
| 5962-8751402YA | EEPROM, 8KX8, 300ns, Parallel, CMOS, CQCC32, | Xicor Inc | K8D6316UBM-PI07 vs 5962-8751402YA |
| LH28F800SGHB-L10 | Flash, 512KX16, 100ns, PBGA48, 8 X 8 MM, FBGA-48 | Sharp Corp | K8D6316UBM-PI07 vs LH28F800SGHB-L10 |
| 5962-8751418XX | EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Pyramid Semiconductor Corporation | K8D6316UBM-PI07 vs 5962-8751418XX |
| WMF512K8-60DEQ5 | Flash, 512KX8, 60ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 | Mercury Systems Inc | K8D6316UBM-PI07 vs WMF512K8-60DEQ5 |
| AT27C256R-15RC | OTP ROM, 32KX8, 150ns, CMOS, PDSO28, 0.330 INCH, PLASTIC, SOIC-28 | Atmel Corporation | K8D6316UBM-PI07 vs AT27C256R-15RC |
| WMF512K8-150FEC5 | Flash, 512KX8, 150ns, CDFP32, CERAMIC, DFP-32 | Mercury Systems Inc | K8D6316UBM-PI07 vs WMF512K8-150FEC5 |
| WMF512K8-150FEQ5A | Flash, 512KX8, 150ns, CDFP32, CERAMIC, DFP-32 | Mercury Systems Inc | K8D6316UBM-PI07 vs WMF512K8-150FEQ5A |
| AT27C512R-55TI | OTP ROM, 64KX8, 55ns, CMOS, PDSO28, PLASTIC, TSOP-28 | Atmel Corporation | K8D6316UBM-PI07 vs AT27C512R-55TI |
| WMF512K8-70CQ5A | Flash, 512KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, CERAMIC, SDIP-32 | Mercury Systems Inc | K8D6316UBM-PI07 vs WMF512K8-70CQ5A |