K8D6316UBM-PI07
vs
WMF512K8-60DEQ5
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MERCURY SYSTEMS INC
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
60 ns
Alternate Memory Width
8
Boot Block
BOTTOM
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PDSO-G48
R-CDSO-J32
Memory Density
67108864 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
8
Number of Sectors/Size
8,127
Number of Terminals
48
32
Number of Words
4194304 words
524288 words
Number of Words Code
4000000
512000
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
4MX16
512KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSSOP
SOJ
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Ready/Busy
YES
Sector Size
8K,64K
Standby Current-Max
0.00003 A
Supply Current-Max
0.05 mA
0.035 mA
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Base Number Matches
4
2
Package Description
SOJ,
Additional Feature
SECTOR ERASE; 10000 ERASE/PROGRAM CYCLES MIN
Length
21.1 mm
Number of Functions
1
Operating Mode
ASYNCHRONOUS
Programming Voltage
5 V
Seated Height-Max
3.96 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Width
10.92 mm
Compare K8D6316UBM-PI07 with alternatives
Compare WMF512K8-60DEQ5 with alternatives