Findchips: Parametric Search Results for K8D6316UBM-PI07


Select Parts		Part Number

		K8D6316UBM-PI07T Samsung Semiconductor
		K8D6316UBMPI0700 Samsung Semiconductor
		K8D6316UBM-PI070 Samsung Semiconductor
		K8D6316UBM-PI07 Samsung Semiconductor

				Most Relevant						Technical																						Compliance		Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

70 ns

FLASH

BOTTOM

YES

8,127

4000000

4.1943 M

PARALLEL

YES

30 µA

50 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

SAMSUNG SEMICONDUCTOR INC

TSSOP, TSSOP56,.8,20

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

70 ns

FLASH

BOTTOM

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

2.7 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SAMSUNG SEMICONDUCTOR INC

12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48

compliant

EAR99

8542.32.00.51

TSOP1

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,127

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

2.7 V

YES

30 µA

50 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SAMSUNG SEMICONDUCTOR INC

12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48

compliant

EAR99

8542.32.00.51

TSOP1

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

70 ns

FLASH

BOTTOM

YES

8,127

4000000

4.1943 M

PARALLEL

YES

30 µA

50 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

SAMSUNG SEMICONDUCTOR INC

compliant

EAR99

8542.32.00.51

Compare

K8D6316UBM-PI07T

Samsung Semiconductor

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

70 ns

FLASH

BOTTOM

YES

8,127

4000000

4.1943 M

PARALLEL

YES

30 µA

50 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G56

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

SAMSUNG SEMICONDUCTOR INC

TSSOP, TSSOP56,.8,20

compliant

EAR99

8542.32.00.51

K8D6316UBMPI0700

Samsung Semiconductor

Check for Price

Yes

Obsolete

67.1089 Mbit

4MX16

3 V

70 ns

FLASH

BOTTOM

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

2.7 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SAMSUNG SEMICONDUCTOR INC

12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48

compliant

EAR99

8542.32.00.51

TSOP1

K8D6316UBM-PI070

Samsung Semiconductor

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

3 V

70 ns

FLASH

BOTTOM

YES

8,127

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

2.7 V

YES

30 µA

50 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP1

TSSOP56,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SAMSUNG SEMICONDUCTOR INC

12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48

compliant

EAR99

8542.32.00.51

TSOP1

K8D6316UBM-PI07

Samsung Semiconductor

Check for Price

Yes

Obsolete

67.1089 Mbit

8K,64K

4MX16

70 ns

FLASH

BOTTOM

YES

8,127

4000000

4.1943 M

PARALLEL

YES

30 µA

50 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

SAMSUNG SEMICONDUCTOR INC

compliant

EAR99

8542.32.00.51

Parametric results for: K8D6316UBM-PI07 under Flash Memories