Memory
GS864418E-133V
GSI Technology
Description: Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

Overview of GS864418E-133V by GSI Technology

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Available Datasheets

Part # Manufacturer Description Datasheet
HD6417706BP133V Renesas Electronics Corporation 32-bit Microcontrollers, T-TBGA, /
HD6417706F133V Renesas Electronics Corporation 32-bit Microcontrollers

Price & Stock for GS864418E-133V by GSI Technology

Part # Manufacturer Description Stock Price Buy
DISTI # GS864418E-133V
Avnet Americas SRAM Chip Sync Dual 1.8V/2.5V 72M-Bit 4M x 18 8.5ns/3.5ns 165-Pin FBGA Tray - Trays (Alt: GS864418E-133V) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 105 $133.4520
  • 210 $131.0256
  • 420 $124.5552
  • 630 $121.3200
  • 840 $117.2760
  • 1,050 $111.6144
  • 10,500 $108.3792
$108.3792 / $133.4520 Buy Now
DISTI # 464-GS864418E-133V
Mouser Electronics SRAM 1.8/2.5V 4M x 18 36M RoHS: Not Compliant 0
  • 15 $121.6300
  • 30 $121.2900
  • 60 $118.0300
$118.0300 / $121.6300 Order Now

CAD Models for GS864418E-133V by GSI Technology
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Part Data Attributes for GS864418E-133V by GSI Technology

GS864418E-133V
GSI Technology
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Ihs Manufacturer
GSI TECHNOLOGY
Part Package Code
BGA
Package Description
LBGA,
Pin Count
165
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
8.5 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
JESD-30 Code
R-PBGA-B165
Length
17 mm
Memory Density
75497472 bit
Memory IC Type
CACHE SRAM
Memory Width
18
Number of Functions
1
Number of Terminals
165
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
4MX18
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
2 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15 mm
Want to compare parts?
  1. GS864418E-133V
    GSI Technology
    Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
    VS

Alternate Parts for GS864418E-133V

This table gives cross-reference parts and alternative options found for GS864418E-133V. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS864418E-133V, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
GS864418E-133IV Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS864418E-133V vs GS864418E-133IV
GS864418GE-133IV Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS864418E-133V vs GS864418GE-133IV
Part Number Description Manufacturer Compare
CY7C1472BV25-200AXC ZBT SRAM, 4MX18, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, TQFP-100 Infineon Technologies AG GS864418E-133V vs CY7C1472BV25-200AXC
GS8644Z18GE-133IV ZBT SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS864418E-133V vs GS8644Z18GE-133IV
GS864418GE-133 Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS864418E-133V vs GS864418GE-133
GS864418GE-133V Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS864418E-133V vs GS864418GE-133V
GS8644Z18E-133V ZBT SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS864418E-133V vs GS8644Z18E-133V
CY7C1472BV25-200AXCT ZBT SRAM, 4MX18, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100 Infineon Technologies AG GS864418E-133V vs CY7C1472BV25-200AXCT
GS864418GE-133IV Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS864418E-133V vs GS864418GE-133IV
CY7C1472BV33-200BZXC ZBT SRAM, 4MX18, 3ns, CMOS, PBGA165, FBGA-165 Infineon Technologies AG GS864418E-133V vs CY7C1472BV33-200BZXC
GS864418E-133 Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS864418E-133V vs GS864418E-133
GS864418GE-133I Cache SRAM, 4MX18, 8.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS864418E-133V vs GS864418GE-133I

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