Part Details for BLF6G27LS-135 by NXP Semiconductors
Overview of BLF6G27LS-135 by NXP Semiconductors
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
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Part Details for BLF6G27LS-135
BLF6G27LS-135 CAD Models
BLF6G27LS-135 Part Data Attributes
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BLF6G27LS-135
NXP Semiconductors
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Datasheet
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BLF6G27LS-135
NXP Semiconductors
TRANSISTOR S BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, CERAMIC PACKAGE-3, FET RF Power
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | ROHS COMPLIANT, CERAMIC PACKAGE-3 | |
Pin Count | 3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
Case Connection | SOURCE | |
Configuration | SINGLE | |
DS Breakdown Voltage-Min | 65 V | |
Drain Current-Max (ID) | 34 A | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
Highest Frequency Band | S BAND | |
JESD-30 Code | R-CDFP-F2 | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 200 °C | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Polarity/Channel Type | N-CHANNEL | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Form | FLAT | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Transistor Application | AMPLIFIER | |
Transistor Element Material | SILICON |
Alternate Parts for BLF6G27LS-135
This table gives cross-reference parts and alternative options found for BLF6G27LS-135. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BLF6G27LS-135, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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934065321112 | 2 CHANNEL, S BAND, Si, N-CHANNEL, RF POWER, MOSFET | NXP Semiconductors | BLF6G27LS-135 vs 934065321112 |
BLF6G27S-45 | RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, ROHS COMPLIANT, CERAMIC PACKAGE-2 | Ampleon | BLF6G27LS-135 vs BLF6G27S-45 |
934060912118 | S BAND, Si, N-CHANNEL, RF POWER, MOSFET | NXP Semiconductors | BLF6G27LS-135 vs 934060912118 |
BLF6G27S-45,112 | RF Power Field-Effect Transistor, 1-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, ROHS COMPLIANT, CERAMIC PACKAGE-2 | Ampleon | BLF6G27LS-135 vs BLF6G27S-45,112 |
934060908135 | S BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, CERAMIC PACKAGE-2 | NXP Semiconductors | BLF6G27LS-135 vs 934060908135 |
BLF6G27S-45,112 | BLF6G27S-45 | NXP Semiconductors | BLF6G27LS-135 vs BLF6G27S-45,112 |
934065321118 | 2 CHANNEL, S BAND, Si, N-CHANNEL, RF POWER, MOSFET | NXP Semiconductors | BLF6G27LS-135 vs 934065321118 |
BLF6G27L-40P | 2 CHANNEL, S BAND, Si, N-CHANNEL, RF POWER, MOSFET, ROHS COMPLIANT, CERAMIC PACKAGE-4 | NXP Semiconductors | BLF6G27LS-135 vs BLF6G27L-40P |
BLF6G27-45,112 | BLF6G27-45 | NXP Semiconductors | BLF6G27LS-135 vs BLF6G27-45,112 |
BLF6G27LS-40P | RF Power Field-Effect Transistor, 2-Element, S Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, ROHS COMPLIANT, CERAMIC PACKAGE-4 | Ampleon | BLF6G27LS-135 vs BLF6G27LS-40P |