Datasheets
AM29F010B-70PI by:

Flash, 128KX8, 70ns, PDIP32, PLASTIC, DIP-32

Part Details for AM29F010B-70PI by AMD

Overview of AM29F010B-70PI by AMD

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Part Details for AM29F010B-70PI

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AM29F010B-70PI Part Data Attributes:

AM29F010B-70PI AMD
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AM29F010B-70PI AMD Flash, 128KX8, 70ns, PDIP32, PLASTIC, DIP-32
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns
Command User Interface YES
Data Polling YES
Endurance 1000000 Write/Erase Cycles
JESD-30 Code R-PDIP-T32
JESD-609 Code e0
Length 42.037 mm
Memory Density 1048576 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Sectors/Size 8
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Sector Size 16K
Standby Current-Max 0.000005 A
Supply Current-Max 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Toggle Bit YES
Type NOR TYPE
Width 15.24 mm

Alternate Parts for AM29F010B-70PI

This table gives cross-reference parts and alternative options found for AM29F010B-70PI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM29F010B-70PI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WMF128K8-70CM5 Flash, 128KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation AM29F010B-70PI vs WMF128K8-70CM5
ACT-F128K8N-070P4Q Flash Module, 128KX8, 70ns, CDIP32, HERMETICALLY SEALED, CERAMIC, DIP-32 Cobham Power Products AM29F010B-70PI vs ACT-F128K8N-070P4Q
5962-9669004HYX Flash, 128KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation AM29F010B-70PI vs 5962-9669004HYX
SST39SF010A-70-4C-PHE Flash, 128KX8, 70ns, PDIP32, ROHS COMPLIANT, PLASTIC, MO-015AP, DIP-32 Silicon Storage Technology AM29F010B-70PI vs SST39SF010A-70-4C-PHE
Part Number Description Manufacturer Compare
HN27C301P-25 OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd AM29F010B-70PI vs HN27C301P-25
HN62331AP MASK ROM, 128KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 Hitachi Ltd AM29F010B-70PI vs HN62331AP
HN27C101AG-12 UVPROM, 128KX8, 120ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Hitachi Ltd AM29F010B-70PI vs HN27C101AG-12
CAT28F010V5PI-12 Flash, 128KX8, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Catalyst Semiconductor AM29F010B-70PI vs CAT28F010V5PI-12
CAT28F010P-70 Flash, 128KX8, 70ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor AM29F010B-70PI vs CAT28F010P-70
WME128K8-120CM EEPROM, 128KX8, 120ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation AM29F010B-70PI vs WME128K8-120CM
MSM531031B-RS 128KX8 MASK PROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 OKI Electric Industry Co Ltd AM29F010B-70PI vs MSM531031B-RS
HN62331AP-12 MASK ROM, 128KX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 Hitachi Ltd AM29F010B-70PI vs HN62331AP-12
5962-9309103HYA EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Microsemi Corporation AM29F010B-70PI vs 5962-9309103HYA
5962-9309103HYC EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Microsemi Corporation AM29F010B-70PI vs 5962-9309103HYC

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