Datasheets
HN27C101AG-12 by:

UVPROM, 128KX8, 120ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32

Part Details for HN27C101AG-12 by Hitachi Ltd

Overview of HN27C101AG-12 by Hitachi Ltd

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Price & Stock for HN27C101AG-12

Part # Distributor Description Stock Price Buy
Quest Components UVPROM, 128KX8, 120NS, CMOS, CDIP32 10
  • 1 $17.0000
  • 4 $12.7500
$12.7500 / $17.0000 Buy Now
Chip1Cloud 1m UV and OTP eprom 24200
RFQ

Part Details for HN27C101AG-12

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HN27C101AG-12 Part Data Attributes

HN27C101AG-12 Hitachi Ltd
Buy Now Datasheet
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HN27C101AG-12 Hitachi Ltd UVPROM, 128KX8, 120ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer HITACHI LTD
Part Package Code DIP
Package Description WDIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 120 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T32
JESD-609 Code e0
Length 41.91 mm
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.89 mm
Standby Current-Max 0.001 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HN27C101AG-12

This table gives cross-reference parts and alternative options found for HN27C101AG-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C101AG-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
FM27C010QE120 UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Rochester Electronics LLC HN27C101AG-12 vs FM27C010QE120
TMS27C010A-12JL 1 048 576-Bit Programmable Read-Only Memory 32-CDIP 0 to 70 Texas Instruments HN27C101AG-12 vs TMS27C010A-12JL
MX27C1000DC-12 UVPROM, 128KX8, 120ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Macronix International Co Ltd HN27C101AG-12 vs MX27C1000DC-12
TMS27C010A-12JE 1 048 576-Bit Programmable Read-Only Memory 32-CDIP -40 to 85 Texas Instruments HN27C101AG-12 vs TMS27C010A-12JE
AM27C010-125DI UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD HN27C101AG-12 vs AM27C010-125DI
NM27C010Q120 UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Fairchild Semiconductor Corporation HN27C101AG-12 vs NM27C010Q120
UPD27C1000AD-12 UVPROM, 128KX8, 120ns, CMOS, CDIP32, WINDOWED, CERDIP-32 NEC Electronics Group HN27C101AG-12 vs UPD27C1000AD-12
M27C1001-15F6X 128KX8 UVPROM, 120ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32 STMicroelectronics HN27C101AG-12 vs M27C1001-15F6X
HN27C301AG-12 128KX8 UVPROM, 120ns, CDIP32, 0.600 INCH, CERDIP-32 Renesas Electronics Corporation HN27C101AG-12 vs HN27C301AG-12
M27C1001-12XF6 128KX8 UVPROM, 120ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics HN27C101AG-12 vs M27C1001-12XF6
Part Number Description Manufacturer Compare
HN27C301AG-10 UVPROM, 128KX8, 100ns, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Hitachi Ltd HN27C101AG-12 vs HN27C301AG-10
CAT28F001LI-90T Flash, 128KX8, 90ns, PDIP32, LEAD AND HALOGEN FREE, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101AG-12 vs CAT28F001LI-90T
DPV27C101-250B UVPROM, 128KX8, 250ns, CMOS, CDIP32, CERDIP-32 B&B Electronics Manufacturing Company HN27C101AG-12 vs DPV27C101-250B
5962-9309103HYA EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 Microsemi Corporation HN27C101AG-12 vs 5962-9309103HYA
AM29F010B-45PI Flash, 128KX8, 45ns, PDIP32, PLASTIC, DIP-32 AMD HN27C101AG-12 vs AM29F010B-45PI
CAT28F001P-15 Flash, 128KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Catalyst Semiconductor HN27C101AG-12 vs CAT28F001P-15
5962-8961403MXX UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor HN27C101AG-12 vs 5962-8961403MXX
28C010TRT4DE-12 EEPROM, 128KX8, 120ns, Parallel, CMOS, DIP-32 Maxwell Technologies HN27C101AG-12 vs 28C010TRT4DE-12
5962-8961416MXX UVPROM, 128KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor HN27C101AG-12 vs 5962-8961416MXX
CAT28F010PI-12 128KX8 FLASH 12V PROM, 120ns, PDIP32, PLASTIC, DIP-32 onsemi HN27C101AG-12 vs CAT28F010PI-12

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