Datasheets
HN27C301P-25 by:

OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

Part Details for HN27C301P-25 by Hitachi Ltd

Overview of HN27C301P-25 by Hitachi Ltd

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Applications Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for HN27C301P-25

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HN27C301P-25 Part Data Attributes:

HN27C301P-25 Hitachi Ltd
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HN27C301P-25 Hitachi Ltd OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Part Life Cycle Code Transferred
Ihs Manufacturer HITACHI LTD
Part Package Code DIP
Package Description DIP,
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 250 ns
JESD-30 Code R-PDIP-T32
Length 41.9 mm
Memory Density 1048576 bit
Memory IC Type OTP ROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HN27C301P-25

This table gives cross-reference parts and alternative options found for HN27C301P-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C301P-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AT27LV010-25PI OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation HN27C301P-25 vs AT27LV010-25PI
TMX27PC010-25NL 128KX8 OTPROM, 250ns, PDIP32 Texas Instruments HN27C301P-25 vs TMX27PC010-25NL
HN27C301AP-25 128KX8 OTPROM, 250ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Renesas Electronics Corporation HN27C301P-25 vs HN27C301AP-25
AM27C010-255PI OTP ROM, 128KX8, 250ns, CMOS, PDIP32, PLASTIC, DIP-32 Spansion HN27C301P-25 vs AM27C010-255PI
TMX27PC010-250NL 128KX8 OTPROM, 250ns, PDIP32 Texas Instruments HN27C301P-25 vs TMX27PC010-250NL
HN27C101AP-25 128KX8 OTPROM, 250ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Renesas Electronics Corporation HN27C301P-25 vs HN27C101AP-25
AT27CL010-25PC OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation HN27C301P-25 vs AT27CL010-25PC
AT27CL010-25PI OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation HN27C301P-25 vs AT27CL010-25PI
HN27C101AP-25 OTP ROM, 128KX8, 250ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd HN27C301P-25 vs HN27C101AP-25
AM27C010-255PC OTP ROM, 128KX8, 250ns, CMOS, PDIP32, PLASTIC, DIP-32 Spansion HN27C301P-25 vs AM27C010-255PC
Part Number Description Manufacturer Compare
SST27SF010-70-3C-PHE Flash, 128KX8, 70ns, PDIP28, LEAD FREE, PLASTIC, MO-015AH, DIP-28 Silicon Storage Technology HN27C301P-25 vs SST27SF010-70-3C-PHE
5962-3826703MXX EEPROM, 128KX8, 200ns, Parallel, CMOS, CDIP32, 0.600 INCH, CERDIP-32 Atmel Corporation HN27C301P-25 vs 5962-3826703MXX
5962-8961404MXX UVPROM, 128KX8, 170ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor HN27C301P-25 vs 5962-8961404MXX
AT28LV010-20PL EEPROM, 128KX8, 200ns, Parallel, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Atmel Corporation HN27C301P-25 vs AT28LV010-20PL
5962-9679605HYX EEPROM, 128KX8, 140ns, Parallel, CMOS, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN27C301P-25 vs 5962-9679605HYX
AM29F010B-55PC Flash, 128KX8, 55ns, PDIP32, PLASTIC, DIP-32 AMD HN27C301P-25 vs AM29F010B-55PC
WMF128K8-60CM5 Flash, 128KX8, 60ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation HN27C301P-25 vs WMF128K8-60CM5
CAT28F001PI-12B Flash, 128KX8, 120ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor HN27C301P-25 vs CAT28F001PI-12B
HN27C101AP-12 OTP ROM, 128KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd HN27C301P-25 vs HN27C101AP-12
CAT28F001PI-12T Flash, 128KX8, 120ns, PDIP32, PLASTIC, DIP-32 Catalyst Semiconductor HN27C301P-25 vs CAT28F001PI-12T

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