There are no models available for this part yet.
Overview of X28C256ET1 by Xicor Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for X28C256ET1 by Xicor Inc
Part Data Attributes for X28C256ET1 by Xicor Inc
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|
|
|---|---|
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Part Life Cycle Code
|
Obsolete
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|
Ihs Manufacturer
|
XICOR INC
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Package Description
|
CERAMIC, LCC-32
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|
Reach Compliance Code
|
unknown
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Access Time-Max
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300 ns
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Additional Feature
|
PAGE WRITE
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JESD-30 Code
|
R-CQCC-N32
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Length
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13.97 mm
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Memory Density
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262144 bit
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Memory IC Type
|
EEPROM
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Memory Width
|
8
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Number of Functions
|
1
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Number of Terminals
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32
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Number of Words
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32768 words
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Number of Words Code
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32000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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|
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Organization
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32KX8
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Output Characteristics
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3-STATE
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Package Body Material
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CERAMIC, METAL-SEALED COFIRED
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Package Code
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QCCN
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Package Shape
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RECTANGULAR
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Package Style
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CHIP CARRIER
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Parallel/Serial
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PARALLEL
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Programming Voltage
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5 V
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Qualification Status
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Not Qualified
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Seated Height-Max
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3.05 mm
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Supply Voltage-Max (Vsup)
|
5.5 V
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Supply Voltage-Min (Vsup)
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4.5 V
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Supply Voltage-Nom (Vsup)
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5 V
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Surface Mount
|
YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Form
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NO LEAD
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Terminal Pitch
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1.27 mm
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Terminal Position
|
QUAD
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Width
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11.43 mm
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Write Cycle Time-Max (tWC)
|
10 ms
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Alternate Parts for X28C256ET1
This table gives cross-reference parts and alternative options found for X28C256ET1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C256ET1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8852510YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256ET1 vs 5962-8852510YX |
| 5962-8852502YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256ET1 vs 5962-8852502YX |
| AM28C256-300LCB | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | X28C256ET1 vs AM28C256-300LCB |
| 5962-8852502YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | X28C256ET1 vs 5962-8852502YX |
| X28C256GMB | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | Xicor Inc | X28C256ET1 vs X28C256GMB |
| 5962-8852510YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | LSI Corporation | X28C256ET1 vs 5962-8852510YX |
| AT28C256F-30LM/883 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256ET1 vs AT28C256F-30LM/883 |
| X28C256E | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256ET1 vs X28C256E |
| AM28C256-300LC | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | X28C256ET1 vs AM28C256-300LC |
| X28C256GM | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | Xicor Inc | X28C256ET1 vs X28C256GM |