Part Details for AM28C256-300LC by AMD
Overview of AM28C256-300LC by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Security and Surveillance
Internet of Things (IoT)
Audio and Video Systems
Computing and Data Storage
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Part Details for AM28C256-300LC
AM28C256-300LC CAD Models
AM28C256-300LC Part Data Attributes
|
AM28C256-300LC
AMD
Buy Now
Datasheet
|
Compare Parts:
AM28C256-300LC
AMD
EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32
|
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | QFJ | |
Package Description | QCCN, | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 300 ns | |
JESD-30 Code | R-CQCC-N32 | |
Memory Density | 262144 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QCCN | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Position | QUAD |
Alternate Parts for AM28C256-300LC
This table gives cross-reference parts and alternative options found for AM28C256-300LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM28C256-300LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
5962-8852510YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | AM28C256-300LC vs 5962-8852510YX |
5962-8852502YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | AM28C256-300LC vs 5962-8852502YX |
AM28C256-300LCB | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | AM28C256-300LC vs AM28C256-300LCB |
5962-8852502YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Teledyne e2v | AM28C256-300LC vs 5962-8852502YX |
X28C256GMB | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | Xicor Inc | AM28C256-300LC vs X28C256GMB |
5962-8852510YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | LSI Corporation | AM28C256-300LC vs 5962-8852510YX |
AT28C256F-30LM/883 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | AM28C256-300LC vs AT28C256F-30LM/883 |
X28C256E | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | AM28C256-300LC vs X28C256E |
X28C256GM | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 | Xicor Inc | AM28C256-300LC vs X28C256GM |
5962-8852502YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | LSI Corporation | AM28C256-300LC vs 5962-8852502YX |