There are no models available for this part yet.
Overview of X28C256GM by Xicor Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for X28C256GM by Xicor Inc
Part Data Attributes for X28C256GM by Xicor Inc
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
XICOR INC
|
|
Package Description
|
FRIT SEALED, CERAMIC, LCC-32
|
|
Reach Compliance Code
|
unknown
|
|
Access Time-Max
|
300 ns
|
|
Command User Interface
|
NO
|
|
Data Polling
|
YES
|
|
Endurance
|
10000 Write/Erase Cycles
|
|
JESD-30 Code
|
R-GQCC-N32
|
|
JESD-609 Code
|
e0
|
|
Length
|
13.97 mm
|
|
Memory Density
|
262144 bit
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|
Memory IC Type
|
EEPROM
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
32
|
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Number of Words
|
32768 words
|
|
Number of Words Code
|
32000
|
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Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
32KX8
|
|
Output Characteristics
|
3-STATE
|
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Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
QCCN
|
|
Package Equivalence Code
|
LCC32,.45X.55
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
CHIP CARRIER
|
|
Page Size
|
64 words
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|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
5 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
3.048 mm
|
|
Standby Current-Max
|
0.0002 A
|
|
Supply Current-Max
|
0.06 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
QUAD
|
|
Toggle Bit
|
YES
|
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Width
|
11.43 mm
|
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Write Cycle Time-Max (tWC)
|
10 ms
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Alternate Parts for X28C256GM
This table gives cross-reference parts and alternative options found for X28C256GM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C256GM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 5962-8852502YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256GM vs 5962-8852502YX |
| AM28C256-305LCB | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | X28C256GM vs AM28C256-305LCB |
| X28C256EMB | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256GM vs X28C256EMB |
| X28256EI | EEPROM, 32KX8, 300ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256GM vs X28256EI |
| AT28C256F-30LM/883 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256GM vs AT28C256F-30LM/883 |
| X28C256EMT1 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256GM vs X28C256EMT1 |
| LE28C256-300 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32 | LSI Corporation | X28C256GM vs LE28C256-300 |
| 5962-8852510YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256GM vs 5962-8852510YX |
| X28C256EIT1 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256GM vs X28C256EIT1 |
| 5962-8852510YC | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32 | Teledyne e2v | X28C256GM vs 5962-8852510YC |