Part Details for X28C256EI by Xicor Inc
Overview of X28C256EI by Xicor Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for X28C256EI
X28C256EI CAD Models
X28C256EI Part Data Attributes
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X28C256EI
Xicor Inc
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Datasheet
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X28C256EI
Xicor Inc
EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | XICOR INC | |
| Package Description | CERAMIC, LCC-32 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 300 ns | |
| Additional Feature | PAGE WRITE | |
| Command User Interface | NO | |
| Data Polling | YES | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-CQCC-N32 | |
| JESD-609 Code | e0 | |
| Length | 13.97 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC32,.45X.55 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Page Size | 64 words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.05 mm | |
| Standby Current-Max | 0.0005 A | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Toggle Bit | YES | |
| Width | 11.43 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for X28C256EI
This table gives cross-reference parts and alternative options found for X28C256EI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C256EI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| X28C256ET1 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256EI vs X28C256ET1 |
| 5962-8852510YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256EI vs 5962-8852510YX |
| AM28C256-300LCB | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | AMD | X28C256EI vs AM28C256-300LCB |
| X28C256EMB | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Xicor Inc | X28C256EI vs X28C256EMB |
| 5962-8852510YX | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | LSI Corporation | X28C256EI vs 5962-8852510YX |
| 5962-8852510YA | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32 | Teledyne e2v | X28C256EI vs 5962-8852510YA |
| AT28C256-30LM/883 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256EI vs AT28C256-30LM/883 |
| AT28C256F-30LM/883 | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | Atmel Corporation | X28C256EI vs AT28C256F-30LM/883 |
| 5962-8852510YC | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32 | Teledyne e2v | X28C256EI vs 5962-8852510YC |
| 5962-8852502YC | EEPROM, 32KX8, 300ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | LSI Corporation | X28C256EI vs 5962-8852502YC |