There are no models available for this part yet.
Overview of X25057M-1.8 by IC Microsystems Sdn Bhd
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 3 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for X25057M-1.8 by IC Microsystems Sdn Bhd
Part Data Attributes for X25057M-1.8 by IC Microsystems Sdn Bhd
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
IC MICROSYSTEMS SDN BHD
|
Part Package Code
|
MSOP
|
Package Description
|
TSSOP, TSSOP8,.19
|
Pin Count
|
8
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Clock Frequency-Max (fCLK)
|
3.3 MHz
|
Data Retention Time-Min
|
100
|
Endurance
|
100000 Write/Erase Cycles
|
JESD-30 Code
|
S-PDSO-G8
|
JESD-609 Code
|
e0
|
Length
|
3 mm
|
Memory Density
|
4096 bit
|
Memory IC Type
|
EEPROM
|
Memory Width
|
8
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
8
|
Number of Words
|
512 words
|
Number of Words Code
|
512
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
512X8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSSOP
|
Package Equivalence Code
|
TSSOP8,.19
|
Package Shape
|
SQUARE
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Parallel/Serial
|
SERIAL
|
Peak Reflow Temperature (Cel)
|
240
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.07 mm
|
Serial Bus Type
|
SPI
|
Standby Current-Max
|
0.000001 A
|
Supply Current-Max
|
0.003 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
1.8 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.65 mm
|
Terminal Position
|
DUAL
|
Width
|
3 mm
|
Write Cycle Time-Max (tWC)
|
10 ms
|
Write Protection
|
HARDWARE/SOFTWARE
|
Alternate Parts for X25057M-1.8
This table gives cross-reference parts and alternative options found for X25057M-1.8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X25057M-1.8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
X25057MI-1.8 | EEPROM, 512X8, Serial, CMOS, PDSO8, MSOP-8 | Xicor Inc | X25057M-1.8 vs X25057MI-1.8 |
X25057MI-1.8 | EEPROM, 512X8, Serial, CMOS, PDSO8, MSOP-8 | IC Microsystems Sdn Bhd | X25057M-1.8 vs X25057MI-1.8 |
X25057M-1.8T1 | EEPROM, 512X8, Serial, CMOS, PDSO8, MSOP-8 | Xicor Inc | X25057M-1.8 vs X25057M-1.8T1 |