X25057M-1.8 vs X25057MI-1.8 feature comparison

X25057M-1.8 IC Microsystems Sdn Bhd

Buy Now Datasheet

X25057MI-1.8 Xicor Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD XICOR INC
Part Package Code MSOP
Package Description TSSOP, TSSOP8,.19 MSOP-8
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 3.3 MHz 3.3 MHz
Data Retention Time-Min 100 100
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e0 e0
Length 3 mm 3 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512X8 512X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP8,.19 TSSOP8,.19
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.07 mm 1.07 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.000001 A 0.000001 A
Supply Current-Max 0.003 mA 0.003 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3 mm 3 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 2
Output Characteristics 3-STATE

Compare X25057M-1.8 with alternatives

Compare X25057MI-1.8 with alternatives