Part Details for WSF512K16-39G2MA by Microsemi Corporation
Overview of WSF512K16-39G2MA by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WSF512K16-39G2MA
WSF512K16-39G2MA CAD Models
WSF512K16-39G2MA Part Data Attributes
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WSF512K16-39G2MA
Microsemi Corporation
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Datasheet
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WSF512K16-39G2MA
Microsemi Corporation
Memory Circuit, 512KX16, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | QFP | |
Package Description | 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 | |
Pin Count | 68 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | SRAM IS ORGANISED AS 512K X 16 | |
JESD-30 Code | S-CQFP-G68 | |
JESD-609 Code | e0 | |
Length | 22.4 mm | |
Memory Density | 8388608 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 68 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 512KX16 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 22.4 mm |
Alternate Parts for WSF512K16-39G2MA
This table gives cross-reference parts and alternative options found for WSF512K16-39G2MA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WSF512K16-39G2MA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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WSF512K16-39G2CA | Memory Circuit, 512KX16, CMOS, CQFP68, 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 | Microsemi Corporation | WSF512K16-39G2MA vs WSF512K16-39G2CA |
5962-9690102HMC | Memory Circuit, 512KX8, CMOS, CDSO68, CERAMIC, QFP-68 | Microsemi Corporation | WSF512K16-39G2MA vs 5962-9690102HMC |
5962-9690102HMA | Memory Circuit, 512KX8, CMOS, CDSO68, CERAMIC, QFP-68 | Microsemi Corporation | WSF512K16-39G2MA vs 5962-9690102HMA |