WSF512K16-39G2MA vs WSF128K32-22H2MA feature comparison

WSF512K16-39G2MA Microsemi Corporation

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WSF128K32-22H2MA White Electronic Designs Corp

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP WHITE ELECTRONIC DESIGNS CORP
Part Package Code QFP
Package Description 22 X 22 MM, HERMETIC SEALED, CERAMIC, QFP-68 CERAMIC, HIP-66
Pin Count 68
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature SRAM IS ORGANISED AS 512K X 16 SRAM ORGANISATION IS 128K X 32
JESD-30 Code S-CQFP-G68 S-CPGA-P66
JESD-609 Code e0
Length 22.4 mm 35.18 mm
Memory Density 8388608 bit 4194304 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 32
Number of Functions 1 1
Number of Terminals 68 66
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX16 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QFP PGA
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 5.7 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING PIN/PEG
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD PERPENDICULAR
Width 22.4 mm 35.18 mm
Base Number Matches 1 1
Access Time-Max 120 ns
Mixed Memory Type FLASH+SRAM
Package Equivalence Code PGA66,11X11
Standby Current-Max 0.08 A
Supply Current-Max 0.67 mA

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Compare WSF128K32-22H2MA with alternatives