Part Details for DPS1MK32MKV3-25B by Twilight Technology Inc
Overview of DPS1MK32MKV3-25B by Twilight Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for DPS1MK32MKV3-25B
DPS1MK32MKV3-25B CAD Models
DPS1MK32MKV3-25B Part Data Attributes
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DPS1MK32MKV3-25B
Twilight Technology Inc
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Datasheet
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DPS1MK32MKV3-25B
Twilight Technology Inc
SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TWILIGHT TECHNOLOGY INC | |
Part Package Code | PGA | |
Package Description | PGA, PGA66,11X11 | |
Pin Count | 66 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 25 ns | |
Additional Feature | USER CONFIGURABLE AS 4M X 8 | |
Alternate Memory Width | 16 | |
I/O Type | COMMON | |
JESD-30 Code | S-CPGA-P66 | |
Memory Density | 33554432 bit | |
Memory IC Type | SRAM MODULE | |
Memory Width | 32 | |
Number of Functions | 1 | |
Number of Terminals | 66 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 1MX32 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | PGA | |
Package Equivalence Code | PGA66,11X11 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Seated Height-Max | 9.144 mm | |
Standby Current-Max | 0.0144 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.96 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for DPS1MK32MKV3-25B
This table gives cross-reference parts and alternative options found for DPS1MK32MKV3-25B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS1MK32MKV3-25B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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DPS1MK32MKV3-20I | SRAM Module, 1MX32, 20ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS1MK32MKV3-25B vs DPS1MK32MKV3-20I |
DPS1MK32MKV3-35M | SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS1MK32MKV3-25B vs DPS1MK32MKV3-35M |
DPS1MK32MKV3-20M | SRAM Module, 1MX32, 20ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS1MK32MKV3-25B vs DPS1MK32MKV3-20M |
WS1M32-17H2I | SRAM Module, 1MX32, 17ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | DPS1MK32MKV3-25B vs WS1M32-17H2I |
WS1M32-25H2MA | SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Mercury Systems Inc | DPS1MK32MKV3-25B vs WS1M32-25H2MA |
DPS1MK32MKV3-35I | SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS1MK32MKV3-25B vs DPS1MK32MKV3-35I |
DPS1MK32MKV3-35C | SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | Twilight Technology Inc | DPS1MK32MKV3-25B vs DPS1MK32MKV3-35C |
DPS1MK32MKV3-30M | SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS1MK32MKV3-25B vs DPS1MK32MKV3-30M |
WS1M32-25H2IA | SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 | Microsemi Corporation | DPS1MK32MKV3-25B vs WS1M32-25H2IA |
DPS1MK32MKV3-25C | SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 | B&B Electronics Manufacturing Company | DPS1MK32MKV3-25B vs DPS1MK32MKV3-25C |