Datasheets
DPS1MK32MKV3-25B by:

SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66

Part Details for DPS1MK32MKV3-25B by Twilight Technology Inc

Overview of DPS1MK32MKV3-25B by Twilight Technology Inc

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Applications Industrial Automation Healthcare Renewable Energy Robotics and Drones

Part Details for DPS1MK32MKV3-25B

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DPS1MK32MKV3-25B Part Data Attributes

DPS1MK32MKV3-25B Twilight Technology Inc
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DPS1MK32MKV3-25B Twilight Technology Inc SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer TWILIGHT TECHNOLOGY INC
Part Package Code PGA
Package Description PGA, PGA66,11X11
Pin Count 66
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 25 ns
Additional Feature USER CONFIGURABLE AS 4M X 8
Alternate Memory Width 16
I/O Type COMMON
JESD-30 Code S-CPGA-P66
Memory Density 33554432 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 66
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 1MX32
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA66,11X11
Package Shape SQUARE
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 9.144 mm
Standby Current-Max 0.0144 A
Standby Voltage-Min 2 V
Supply Current-Max 0.96 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Alternate Parts for DPS1MK32MKV3-25B

This table gives cross-reference parts and alternative options found for DPS1MK32MKV3-25B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS1MK32MKV3-25B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
DPS1MK32MKV3-20I SRAM Module, 1MX32, 20ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS1MK32MKV3-25B vs DPS1MK32MKV3-20I
DPS1MK32MKV3-35M SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc DPS1MK32MKV3-25B vs DPS1MK32MKV3-35M
DPS1MK32MKV3-20M SRAM Module, 1MX32, 20ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc DPS1MK32MKV3-25B vs DPS1MK32MKV3-20M
WS1M32-17H2I SRAM Module, 1MX32, 17ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPS1MK32MKV3-25B vs WS1M32-17H2I
WS1M32-25H2MA SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc DPS1MK32MKV3-25B vs WS1M32-25H2MA
DPS1MK32MKV3-35I SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS1MK32MKV3-25B vs DPS1MK32MKV3-35I
DPS1MK32MKV3-35C SRAM Module, 1MX32, 35ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 Twilight Technology Inc DPS1MK32MKV3-25B vs DPS1MK32MKV3-35C
DPS1MK32MKV3-30M SRAM Module, 1MX32, 30ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS1MK32MKV3-25B vs DPS1MK32MKV3-30M
WS1M32-25H2IA SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation DPS1MK32MKV3-25B vs WS1M32-25H2IA
DPS1MK32MKV3-25C SRAM Module, 1MX32, 25ns, CMOS, CPGA66, 1.190 X 1.190 INCH, 0.360 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company DPS1MK32MKV3-25B vs DPS1MK32MKV3-25C

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