Memory
WF2M32B-90HC5A
Description: Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

Overview of WF2M32B-90HC5A by Microsemi Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Space Technology Environmental Monitoring Aerospace and Defense Energy and Power Systems Renewable Energy Medical Imaging Robotics and Drones

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Part Data Attributes for WF2M32B-90HC5A by Microsemi Corporation

WF2M32B-90HC5A
Microsemi Corporation
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Transferred
Ihs Manufacturer
MICROSEMI CORP
Part Package Code
PGA
Package Description
PGA,
Pin Count
66
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
90 ns
Additional Feature
USER CONFIGURABLE AS 4M X 16 OR 2M X 32; 100000 WRITE/ERASE CYCLES MIN
JESD-30 Code
S-CPGA-P66
Length
30.1 mm
Memory Density
67108864 bit
Memory IC Type
FLASH MODULE
Memory Width
8
Number of Functions
1
Number of Terminals
66
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8MX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
5 V
Qualification Status
Not Qualified
Seated Height-Max
6.22 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
30.1 mm
Want to compare parts?
  1. WF2M32B-90HC5A
    Microsemi Corporation
    Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
    VS

Alternate Parts for WF2M32B-90HC5A

This table gives cross-reference parts and alternative options found for WF2M32B-90HC5A. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WF2M32B-90HC5A, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
WF2M32B-90HC5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32B-90HC5A
WF2M32B-90HI5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WF2M32B-90HC5A vs WF2M32B-90HI5A
WF2M32B-90HC5 Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WF2M32B-90HC5A vs WF2M32B-90HC5
WF2M32B-90HM5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WF2M32B-90HC5A vs WF2M32B-90HM5A
WF2M32B-90HM5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32B-90HM5A
WF2M32B-90HM5 Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32B-90HM5
WF2M32B-90HC5 Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32B-90HC5
WF2M32B-90HI5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32B-90HI5A
Part Number Description Manufacturer Compare
WF2M32BI-90HI5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32BI-90HI5A
WF2M32BI-150HI5A Flash Module, 8MX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32BI-150HI5A
WF2M32B-90HI5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32B-90HI5A
WF2M32B-120HC5 Flash Module, 8MX8, 120ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32B-120HC5
DPZ4MX16NV3-12I Flash Module, 8MX8, 120ns, CPGA66, 1.090 X 1.090 INCH, 0.400 INCH HEIGHT, VERSA STACK, CERAMIC, PGA-66 B&B Electronics Manufacturing Company WF2M32B-90HC5A vs DPZ4MX16NV3-12I
WF2M32B-120HM5 Flash Module, 8MX8, 120ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WF2M32B-90HC5A vs WF2M32B-120HM5
WF2M32BI-150HC5A Flash Module, 8MX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WF2M32B-90HC5A vs WF2M32BI-150HC5A
WF2M32B-90HI5A Flash Module, 8MX8, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WF2M32B-90HC5A vs WF2M32B-90HI5A
WF2M32BI-150HM5 Flash Module, 8MX8, 150ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Microsemi Corporation WF2M32B-90HC5A vs WF2M32BI-150HM5
ACT-F2M32N-100P1M Flash Module, 8MX8, 100ns, CPGA66, 1.380 X 1.380 INCH, 0.245 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 Cobham Power Products WF2M32B-90HC5A vs ACT-F2M32N-100P1M

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