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Overview of W3E64M16S-266NBI by Microsemi Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 7 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Computing and Data Storage
CAD Models for W3E64M16S-266NBI by Microsemi Corporation
Part Data Attributes for W3E64M16S-266NBI by Microsemi Corporation
|
|
---|---|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
MICROSEMI CORP
|
Part Package Code
|
BGA
|
Package Description
|
LBGA,
|
Pin Count
|
60
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.32
|
Access Mode
|
FOUR BANK PAGE BURST
|
Access Time-Max
|
0.75 ns
|
Additional Feature
|
AUTO/SELF REFRESH
|
JESD-30 Code
|
R-PBGA-B60
|
Length
|
12.5 mm
|
Memory Density
|
1073741824 bit
|
Memory IC Type
|
DDR DRAM
|
Memory Width
|
16
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
60
|
Number of Words
|
67108864 words
|
Number of Words Code
|
64000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
64MX16
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.5 mm
|
Self Refresh
|
YES
|
Supply Voltage-Max (Vsup)
|
2.7 V
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
10 mm
|
Alternate Parts for W3E64M16S-266NBI
This table gives cross-reference parts and alternative options found for W3E64M16S-266NBI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W3E64M16S-266NBI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
W3E64M16S-266SBC | DDR DRAM, | Mercury Systems Inc | W3E64M16S-266NBI vs W3E64M16S-266SBC |
W3E64M16S-266NBM | DDR DRAM, 64MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, 1.50 MM HEIGHT, PLASTIC, BGA-60 | Mercury Systems Inc | W3E64M16S-266NBI vs W3E64M16S-266NBM |
W3E64M16S-266NBC | DDR DRAM, 64MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, 1.50 MM HEIGHT, PLASTIC, BGA-60 | Microsemi Corporation | W3E64M16S-266NBI vs W3E64M16S-266NBC |
W3E64M16S-266SBM | DDR DRAM, 64MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, BGA-60 | Microsemi Corporation | W3E64M16S-266NBI vs W3E64M16S-266SBM |
W3E64M16S-266NBI | DDR DRAM, 64MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, 1.50 MM HEIGHT, PLASTIC, BGA-60 | Mercury Systems Inc | W3E64M16S-266NBI vs W3E64M16S-266NBI |
W3E64M16S-266SBI | DDR DRAM, 64MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, BGA-60 | Microsemi Corporation | W3E64M16S-266NBI vs W3E64M16S-266SBI |
W3E64M16S-266SBM | DDR DRAM, 64MX16, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, BGA-60 | Mercury Systems Inc | W3E64M16S-266NBI vs W3E64M16S-266SBM |