W3E64M16S-266NBI
vs
MT47H64M16JN-187ELAT:H
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LBGA,
8 X 10 MM, FBGA-60
Pin Count
60
60
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FOUR BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
0.75 ns
0.35 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
Length
12.5 mm
10 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR DRAM
DDR2 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.7 V
1.9 V
Supply Voltage-Min (Vsup)
2.3 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
8 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD SILVER
Compare W3E64M16S-266NBI with alternatives
Compare MT47H64M16JN-187ELAT:H with alternatives