There are no models available for this part yet.
Overview of U630H04BD1K25 by ZMDI
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Space Technology
Aerospace and Defense
Energy and Power Systems
CAD Models for U630H04BD1K25 by ZMDI
Part Data Attributes for U630H04BD1K25 by ZMDI
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
ZENTRUM MIKROELEKTRONIK DRESDEN AG
|
Part Package Code
|
DIP
|
Package Description
|
DIP, DIP28,.6
|
Pin Count
|
28
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
25 ns
|
JESD-30 Code
|
R-PDIP-T28
|
JESD-609 Code
|
e0
|
Length
|
37.1 mm
|
Memory Density
|
4096 bit
|
Memory IC Type
|
NON-VOLATILE SRAM
|
Memory Width
|
8
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
28
|
Number of Words
|
512 words
|
Number of Words Code
|
512
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
512X8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
DIP
|
Package Equivalence Code
|
DIP28,.6
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
5.1 mm
|
Standby Current-Max
|
0.001 A
|
Supply Current-Max
|
0.095 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Width
|
15.24 mm
|
Alternate Parts for U630H04BD1K25
This table gives cross-reference parts and alternative options found for U630H04BD1K25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of U630H04BD1K25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
U630H04BD1C25 | 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Cypress Semiconductor | U630H04BD1K25 vs U630H04BD1C25 |
U630H04BD1K25 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Simtek Corporation | U630H04BD1K25 vs U630H04BD1K25 |
STK20C04-WF25 | 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Cypress Semiconductor | U630H04BD1K25 vs STK20C04-WF25 |
U630H04BD1C25G1 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Simtek Corporation | U630H04BD1K25 vs U630H04BD1C25G1 |
STK20C04-WF25I | 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Cypress Semiconductor | U630H04BD1K25 vs STK20C04-WF25I |
U630H04BD1K25G1 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | ZMDI | U630H04BD1K25 vs U630H04BD1K25G1 |
U630H04BD1C25 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Simtek Corporation | U630H04BD1K25 vs U630H04BD1C25 |
U630H04BD1C25 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | ZMDI | U630H04BD1K25 vs U630H04BD1C25 |
U630H04BD1C25G1 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | ZMDI | U630H04BD1K25 vs U630H04BD1C25G1 |
U630H04BD1K25 | 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Cypress Semiconductor | U630H04BD1K25 vs U630H04BD1K25 |